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公开(公告)号：US11313628B2
公开(公告)日：2022-04-26
申请号：US17158975
申请日：2021-01-26
发明人： Chien-Hung Sun , Te-Hsuan Chin , Lei-Lei Liu
摘要： A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.
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公开(公告)号：US10069442B2
公开(公告)日：2018-09-04
申请号：US15411858
申请日：2017-01-20
发明人： Te-Hsuan Chin , Shui-Fa Tsai
CPC分类号： H02N11/002 , F03G7/06 , H01L23/427 , H02K7/1823 , H02K9/20 , H05K7/20327 , H05K7/20336
摘要： A heat dissipation device applied to a heat source includes a heat conduction unit and a power generation unit. A fluid chamber and a rotor chamber are configured inside the heat conduction unit. The fluid chamber and the rotor chamber are communicated with each other. A working fluid is configured in the fluid chamber. The power generation unit has a rotor and a power generation module. The rotor is connected to the power generation module and is configured in the rotor chamber. The rotor is driven by the working fluid so as to enable the power generation unit to output electrical energy. An electronic system with the heat dissipation device is also disclosed.
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公开(公告)号：US10935326B2
公开(公告)日：2021-03-02
申请号：US16444771
申请日：2019-06-18
发明人： Chien-Hung Sun , Te-Hsuan Chin , Lei-Lei Liu
摘要： A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.
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公开(公告)号：US11493280B2
公开(公告)日：2022-11-08
申请号：US17147334
申请日：2021-01-12
发明人： Chien-Hung Sun , Te-Hsuan Chin
摘要： A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.
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公开(公告)号：US10371458B2
公开(公告)日：2019-08-06
申请号：US15352804
申请日：2016-11-16
发明人： Chien-Hung Sun , Te-Hsuan Chin , Lei-Lei Liu
摘要： A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh is passed out from the opening to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.
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