CONNECTOR ASSEMBLY
    1.
    发明申请
    CONNECTOR ASSEMBLY 审中-公开

    公开(公告)号:US20190369681A1

    公开(公告)日:2019-12-05

    申请号:US16140604

    申请日:2018-09-25

    摘要: The disclosure provides a connector assembly which includes a first connector module, a second connector module and a connection assistance module. The first connector module includes a first carrier and two first connectors which are fixed to the first carrier. The second connector module includes a second carrier and two second connectors which are fixed to the second carrier. The second connectors are respectively and detachably connected to the first connectors. The connection assistance module includes a rotatable component and an assembled component respectively disposed on the first carrier and the second carrier. The rotatable component has an inclined surface, and the assembled component has an engaging portion. When the rotatable component is rotated, the engaging portion is guided by the inclined surface so that the first carrier is moved toward or away from the second carrier, allowing the first connectors to be detachably connected to the second connectors.

    PIPE CONNECTOR AND ELECTRONIC DEVICE
    2.
    发明申请

    公开(公告)号:US20170254459A1

    公开(公告)日:2017-09-07

    申请号:US15203018

    申请日:2016-07-06

    发明人: Hsin-Hung CHEN

    IPC分类号: F16L37/084 H05K7/20

    摘要: A pipe connector for connecting with an additional pipe connector includes a first leak-proof pipe, a first sleeve, at least one clamping element and a restricting structure. The first sleeve covers the first leak-proof pipe and allows the first leak-proof pipe to relatively slide therein. The clamping element and the restricting structure are disposed on the first sleeve. The restricting structure is capable of driving the clamping element to clamp or release the additional pipe connector at different positions.

    CONTROL VALVE
    3.
    发明公开
    CONTROL VALVE 审中-公开

    公开(公告)号:US20230323960A1

    公开(公告)日:2023-10-12

    申请号:US18209407

    申请日:2023-06-13

    IPC分类号: F16K5/10 F16K11/076 F16K5/04

    摘要: The disclosure provides a control valve which includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate, and a diameter of the cylindrical valve gate is be smaller than a caliber of an opening of the valve body. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.

    CONTROL VALVE
    4.
    发明申请

    公开(公告)号:US20210180703A1

    公开(公告)日:2021-06-17

    申请号:US17188555

    申请日:2021-03-01

    IPC分类号: F16K5/10 F16K11/076 F16K5/04

    摘要: The disclosure provides a control valve which includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.

    HEAT DISSIPATION DEVICE
    5.
    发明申请

    公开(公告)号:US20180352645A1

    公开(公告)日:2018-12-06

    申请号:US15908783

    申请日:2018-02-28

    IPC分类号: H05K1/02 G06F1/20 F28D9/00

    摘要: A heat dissipation device includes a heat dissipation piece, heat conduction plates, a rod piece and a switch. The heat conduction plates are connected to the heat dissipation piece and spaced apart from and arranged parallel to each other so as to define accommodating spaces. Each heat conduction plate has a free end away from the heat dissipation piece, and the free end has a through hole. The rod piece has a first end and a second end opposite to each other, the rod piece penetrates through the through holes, and the second end has a limitation portion. The switch has a cam portion pivoted to the first end. When the switch is pivoted with respect to the heat conduction plates, the cam portion drives the rod piece to move among the through holes, making the limitation portion to press against or be separated from the heat conduction plates.

    PRESSURE RELIEF DEVICE AND LIQUID COOLING SYSTEM
    6.
    发明申请
    PRESSURE RELIEF DEVICE AND LIQUID COOLING SYSTEM 审中-公开
    压力消除装置和液体冷却系统

    公开(公告)号:US20170079166A1

    公开(公告)日:2017-03-16

    申请号:US14954258

    申请日:2015-11-30

    IPC分类号: H05K7/20 F16K24/04

    摘要: A pressure relief device is applied to a liquid cooling system. The pressure relief device includes an exhaust valve and a valve seat. The valve seat is connected with the exhaust valve to form a chamber. The valve seat has an inlet, an outlet and a protrusion. The inlet and the outlet are individually communicated with the chamber. The protrusion is located at the bottom of the valve seat and protrudes toward the exhaust valve. A liquid cooling system with the pressure relief device is also disclosed.

    摘要翻译: 压力释放装置应用于液体冷却系统。 减压装置包括排气阀和阀座。 阀座与排气阀连接形成一个室。 阀座具有入口,出口和突起。 入口和出口分别与腔室连通。 突出部位于阀座的底部并向排气阀突出。 还公开了具有减压装置的液体冷却系统。

    LIQUID COOLING DEVICE
    7.
    发明申请

    公开(公告)号:US20190387609A1

    公开(公告)日:2019-12-19

    申请号:US16197621

    申请日:2018-11-21

    IPC分类号: H05K1/02 H05K7/20

    摘要: A liquid cooling device, which is configured to be in thermal contact with a first and a second heat sources which are disposed on a PCB, includes a first and a second thermal plates and a first and a second thermal blocks. The first thermal plate is configured to be disposed on the PCB. The second thermal plate is disposed on the first thermal plate. The thermal plates together form a storage space configured to store a coolant. The thermal blocks are configured to respectively be in thermal contact with the heat sources. The thermal blocks are movably disposed on the second thermal plate, such that protruding heights of the thermal blocks from the second thermal plate are adjustable respectively according to a gap width between the first heat source and the second thermal plate and a gap width between the second heat source and the second thermal plate.

    WATER SUPPLY STRUCTURE OF LIQUID COOLING DEVICE, PUMP HAVING WATER SUPPLY STRUCTUE AND LIQUID COOLING DEVICE HAVING WATER SUPPLY STRUCTURE
    8.
    发明申请
    WATER SUPPLY STRUCTURE OF LIQUID COOLING DEVICE, PUMP HAVING WATER SUPPLY STRUCTUE AND LIQUID COOLING DEVICE HAVING WATER SUPPLY STRUCTURE 有权
    液体冷却装置的供水结构,具有水供应结构的泵和具有供水结构的液体冷却装置

    公开(公告)号:US20160115676A1

    公开(公告)日:2016-04-28

    申请号:US14866616

    申请日:2015-09-25

    IPC分类号: E03B7/07 F04B19/22 F28F27/00

    CPC分类号: F24D1/08 F28F27/00

    摘要: A water supply structure of a liquid cooling device, a pump and a liquid cooling device having the water supply structure are disclosed. The water supply structure, disposed on the cooling device or on the pump, includes a lower lid, an upper lid, and a pressure control member. An outlet is in the lower lid and communicates with the cooling device or with the pump. The upper lid is combined on the lower lid. A chamber, formed between the lower lid and the upper lid, communicates with the outlet and accommodates a coolant. The pressure control member is moveable in the chamber and includes a piston and an elastic part controlling the piston to move inside the chamber. The elastic part pushes against the piston to move inside the chamber such that the coolant is injected into the cooling device until hydraulic pressure equilibrium is achieved.

    摘要翻译: 公开了一种液体冷却装置的供水结构,具有供水结构的泵和液体冷却装置。 设置在冷却装置或泵上的供水结构包括下盖,上盖和压力控制构件。 出口位于下盖中,与冷却装置或泵连通。 上盖组合在下盖上。 形成在下盖和上盖之间的室与出口连通并容纳冷却剂。 压力控制构件可在腔室中移动并且包括活塞和控制活塞以在腔室内移动的弹性部件。 弹性部件推动活塞在室内移动,使得冷却剂被注入冷却装置,直到达到液压平衡。