公开(公告)号：US20130099886A1

公开(公告)日：2013-04-25

申请号：US13709793

申请日：2012-12-10

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Yipeng Yan ,  Robert James Bogert ,  Guo Ouyang ,  Zhigang Cheng

IPC: H01F27/30

CPC classification number: H01F27/303 ,  H01F3/14 ,  H01F17/04 ,  H01F17/043 ,  H01F27/255 ,  H01F27/2847 ,  H01F27/292 ,  H01F27/306 ,  H01F41/00 ,  H01F41/0246 ,  H01F2017/046 ,  Y10T29/49073

Abstract: Magnetic components including pre-formed clips are described that are more amenable to production on a miniaturized scale. Discrete core pieces can be assembled with pre-formed coils and physically gapped from one another with more efficient manufacturing techniques.

Abstract translation: 描述了包括预先形成的夹子的磁性部件，其更适于在小型化的尺度上生产。 分离的芯片可以用预先形成的线圈组装，并且通过更有效的制造技术彼此物理地间隙。

公开(公告)号：US09275787B2

公开(公告)日：2016-03-01

申请号：US13709793

申请日：2012-12-10

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Yipeng Yan ,  Robert James Bogert ,  Guo Ouyang ,  Zhigang Cheng

IPC: H01F27/29 ,  H01F27/24 ,  H01F27/30 ,  H01F17/04 ,  H01F27/28 ,  H01F41/00 ,  H01F41/02 ,  H01F3/14 ,  H01F27/255

CPC classification number: H01F27/303 ,  H01F3/14 ,  H01F17/04 ,  H01F17/043 ,  H01F27/255 ,  H01F27/2847 ,  H01F27/292 ,  H01F27/306 ,  H01F41/00 ,  H01F41/0246 ,  H01F2017/046 ,  Y10T29/49073

Abstract: Magnetic components including pre-formed clips are described that are more amenable to production on a miniaturized scale. Discrete core pieces can be assembled with pre-formed coils and physically gapped from one another with more efficient manufacturing techniques.

公开(公告)号：US20160005528A1

公开(公告)日：2016-01-07

申请号：US14854822

申请日：2015-09-15

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Yipeng Yan ,  Robert James Bogert ,  Brent Elliot ,  Guo Ouyang

IPC: H01F27/29

CPC classification number: H01F27/292 ,  H01F27/2847 ,  H01F27/306

Abstract: An electromagnet component assembly includes a preformed conductive winding formed in at least first and second pieces for assembly with a single magnetic core with a simplified and relatively low cost manufacture. The assembly provides a power inductor operable at higher current, higher power levels with reduced direct current resistance.

Abstract translation: 电磁体部件组件包括形成在至少第一和第二部件中的预成型导电绕组，用于与简单且相对低成本制造的单个磁芯组装。 该组件提供可在更高电流，更高功率水平下工作的功率电感器，降低直流电阻。

公开(公告)号：US20160260536A1

公开(公告)日：2016-09-08

申请号：US15155523

申请日：2016-05-16

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Renford Hanley ,  Guo Ouyang ,  Dengyan Zhou ,  Robert James Bogert ,  Yipeng Yan

IPC: H01F27/28 ,  H01F27/29 ,  H05K1/18 ,  H01F27/24

CPC classification number: H01F27/28 ,  H01F17/04 ,  H01F27/24 ,  H01F27/29 ,  H01F27/292 ,  H05K1/182

Abstract: A surface mount power inductor component for a circuit board includes a magnetic body, at least one conductive coil, and surface mount terminations for completing an electrical connection between the conductive coil and the circuit board. One of the body and the surface mount terminations is configured to accommodate a separately provided component in a vertically stacked relation with the separately provided circuit board component being located between the circuit board and the body.

Abstract translation: 用于电路板的表面贴装功率电感器部件包括磁体，至少一个导电线圈和表面安装端子，用于完成导电线圈和电路板之间的电连接。 主体和表面安装端子之一被配置为容纳与垂直堆叠关系的单独提供的部件，其中单独提供的电路板部件位于电路板和主体之间。