公开(公告)号：US20230368960A1

公开(公告)日：2023-11-16

申请号：US17663400

申请日：2022-05-13

Applicant: Raytheon Company

Inventor： Dennis W. Mercier ,  David Dazuo Zhu

IPC: H01F27/26 ,  H05K1/16 ,  H01F27/30 ,  H01F27/28

CPC classification number: H01F27/263 ,  H05K1/165 ,  H01F27/303 ,  H01F27/2804 ,  H01F2027/2819 ,  H01F2027/2809

Abstract: A winding assembly, such as a transformer or an inductor, includes a spring clip and a retaining clip for mechanically coupling the winding assembly to a printed circuit board (PCB) or a printed wiring board (PWB). The clips provide structural rigidity to the winding assembly, allowing the winding assembly to remain functional during high shock events. Further, the clips compress a thermal pad positioned beneath the winding assembly, providing sufficient heat transfer surface area for transferring heat away from the winding assembly.

公开(公告)号：US20180350512A1

公开(公告)日：2018-12-06

申请号：US16047015

申请日：2018-07-27

Applicant: Delta Electronics,Inc.

Inventor： Haijun YANG ,  Chunmei WANG ,  Chen ZENG ,  Zengyi LU ,  Jinfa ZHANG

IPC: H01F27/28 ,  H01F27/22 ,  H01F27/24 ,  H01F27/30 ,  H01F27/32

CPC classification number: H01F27/2876 ,  H01F27/02 ,  H01F27/22 ,  H01F27/24 ,  H01F27/26 ,  H01F27/2823 ,  H01F27/29 ,  H01F27/303 ,  H01F27/306 ,  H01F27/325 ,  H01F27/38

Abstract: A magnetic device includes a housing, a bobbin, at least one coil, and a first magnetic core and a second magnetic core. The housing has at least one side plate and a bottom plate. The side plate stands on the bottom plate and forms a space with the bottom plate. The bobbin is at least partially located in the space. The bobbin has a cylinder. The at least one coil is wound around the cylinder. Each of the first and second magnetic cores includes a center column, a side column, a connecting portion, and a metal clip. The center column is located in the cylinder. The side column is located outside the coil and away from the bottom plate, such that the coil is located between the side column and the bottom plate. The connecting portion connects the center column and the side column.

公开(公告)号：US20180047499A1

公开(公告)日：2018-02-15

申请号：US15672536

申请日：2017-08-09

Applicant: Cooper Technologies Company

Inventor： Richard James Smith

IPC: H01F27/32 ,  H01F30/12 ,  H01F27/30 ,  H02M1/44 ,  H01F27/24 ,  H02M3/335 ,  H02M1/32

CPC classification number: H01F27/321 ,  H01F27/02 ,  H01F27/24 ,  H01F27/303 ,  H01F30/12 ,  H01F2027/404 ,  H02J3/00 ,  H02J3/01 ,  H02J3/18 ,  H02M1/32 ,  H02M1/44 ,  H02M3/33507 ,  Y02E40/30 ,  Y02E40/40

Abstract: A power system having a transformer and integrated power conditioning device is disclosed. The transformer includes a fluid enclosure that holds transformer fluid therein that immerses a core and coil assembly. The power conditioning device is integrated with the transformer and connected thereto to receive an output power and is within an electrical enclosure. A power conditioning circuit is configured to perform power conversion and conditioning on the output power from the transformer. A first set of electrical conductors is coupled between the core and coil assembly and the power conditioning circuit to transfer the output power from the transformer to the power conditioning circuit and a second set of electrical conductors is coupled between the power conditioning circuit and electrical connections on a front plate of the fluid enclosure, the second set of electrical conductors being routed through the fluid enclosure of the transformer.

公开(公告)号：US09704639B2

公开(公告)日：2017-07-11

申请号：US14536103

申请日：2014-11-07

Applicant: Solantro Semiconductor Corp.

Inventor： Raymond Kenneth Orr ,  James Benson Bacque ,  Mark Roy Harris

IPC: H01L23/495 ,  H01L23/64 ,  H01L23/48 ,  H01F27/28 ,  H01L23/00 ,  H01L21/48 ,  H01F27/29 ,  H01F27/30 ,  H01L23/522 ,  H01L23/66

CPC classification number: H01F27/2804 ,  H01F27/2852 ,  H01F27/29 ,  H01F27/303 ,  H01F2027/2819 ,  H01L21/4842 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49544 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48177 ,  H01L2924/00014 ,  H01L2924/1711 ,  H01L2924/1715 ,  H01L2924/173 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2224/45099

Abstract: The present disclosure relates to non-planar inductive electrical elements in semiconductor package lead frames. A non-planar inductive element is formed from a lead frame in a semiconductor package. The semiconductor package also includes at least one semiconductor die coupled to the lead frame. The non-planar inductive element could be formed by deforming portions of a patterned planar lead frame blank to form the non-planar inductive element in a deformed lead frame blank. The deformed lead frame blank and the at least one semiconductor die could then be packaged into a semiconductor package. A setting tool could be used to deform the lead frame blank. A configurable lead frame blank could be configurable into any of a variety of inductive elements, through interconnection of lead frame segments using wire bonds, for example.

公开(公告)号：US09627127B2

公开(公告)日：2017-04-18

申请号：US14131858

申请日：2011-08-01

Applicant: Ernesto D'Antuono

Inventor： Ernesto D'Antuono

IPC: H01F27/30 ,  H01F29/02

CPC classification number: H01F27/303 ,  H01F29/02 ,  Y10T307/747

Abstract: An energy-saving device (1) inserted between a three-phase power supply (A) and a three-phase load (L), includes a three-phase electrical transformer (10), each phase of which includes a transformation assembly (11) with a primary winding (2) connected at a first end (5) to one phase of the power supply (A) and electromagnetically coupled to a secondary winding (3) connected at its second end (S1) to one phase of the load (L). The device (1) involves the second ends (6) of the primary windings (2) in each of the transformation assemblies (11), lying opposite the first ends (5), being electrically connected to one another by a first switch (4). The device (1) also involves each of the secondary windings (3) being connected in parallel to a second switch (7) for enabling or disabling the operation of the energy-saving device (1) between the power source (A) and the load (L).

公开(公告)号：US09536659B2

公开(公告)日：2017-01-03

申请号：US13700038

申请日：2011-05-23

Applicant: Simon James Calvert ,  Russell Peter Gore

Inventor： Simon James Calvert ,  Russell Peter Gore

IPC: G01V3/00 ,  H01F41/00 ,  G01R33/38 ,  G01R33/381 ,  H01F5/02 ,  H01F6/06 ,  H01F41/12 ,  H01F5/06 ,  H01F27/30 ,  H01F27/32 ,  H01F41/04 ,  G01R33/3815

CPC classification number: H01F41/005 ,  G01R33/3802 ,  G01R33/381 ,  G01R33/3815 ,  H01F5/02 ,  H01F5/06 ,  H01F6/06 ,  H01F27/303 ,  H01F27/327 ,  H01F41/048 ,  H01F41/127 ,  Y10T29/4902 ,  Y10T29/49071

Abstract: A magnet assembly has a number of axially-aligned coils, the radial mid-point of each coil being axially-aligned with a portion of a radial extent of an adjacent coil in the assembly. Compression blocks are provided between adjacent coils at circumferential intervals, to retain the coils in fixed relative positions.

Abstract translation: 磁体组件具有多个轴向对齐的线圈，每个线圈的径向中点与组件中相邻线圈的径向范围的一部分轴向对准。 在相邻线圈之间以周向间隔设置压缩块，以将线圈保持在固定的相对位置。

公开(公告)号：US20160133373A1

公开(公告)日：2016-05-12

申请号：US14536103

申请日：2014-11-07

Applicant: Solantro Semiconductor Corp.

Inventor： Raymond Kenneth Orr ,  James Benson Bacque ,  Mark Roy Harris

IPC: H01F27/28 ,  H01F27/30 ,  H01L21/48 ,  H01F27/29 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01F27/2804 ,  H01F27/2852 ,  H01F27/29 ,  H01F27/303 ,  H01F2027/2819 ,  H01L21/4842 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49544 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48177 ,  H01L2924/00014 ,  H01L2924/1711 ,  H01L2924/1715 ,  H01L2924/173 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2224/45099

Abstract: The present disclosure relates to non-planar inductive electrical elements in semiconductor package lead frames. A non-planar inductive element is formed from a lead frame in a semiconductor package. The semiconductor package also includes at least one semiconductor die coupled to the lead frame. The non-planar inductive element could be formed by deforming portions of a patterned planar lead frame blank to form the non-planar inductive element in a deformed lead frame blank. The deformed lead frame blank and the at least one semiconductor die could then be packaged into a semiconductor package. A setting tool could be used to deform the lead frame blank. A configurable lead frame blank could be configurable into any of a variety of inductive elements, through interconnection of lead frame segments using wire bonds, for example.

Abstract translation: 本公开涉及半导体封装引线框架中的非平面感应电元件。 非平面感应元件由半导体封装中的引线框形成。 半导体封装还包括耦合到引线框架的至少一个半导体管芯。 可以通过使图案化的平面引线框架坯件的部分变形以在变形的引线框架坯件中形成非平面感应元件来形成非平面感应元件。 然后可以将变形的引线框架坯件和至少一个半导体管芯封装成半导体封装。 可以使用设置工具使引线框架空白变形。 例如，通过使用引线键的引线框架段的互连，可配置的引线框架空白可以被配置成各种电感元件中的任何一个。

公开(公告)号：US20160086711A1

公开(公告)日：2016-03-24

申请号：US14541670

申请日：2014-11-14

Applicant: DELTA ELECTRONICS, INC.

Inventor： Ssu-Wei Fu ,  Yi-Hsin Leu ,  Chung-Ping Ku ,  Der-Min Liu

IPC: H01F27/06 ,  H01F27/28 ,  H01F27/30 ,  H01F27/24

CPC classification number: H01F27/06 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/303 ,  H01F2027/2819

Abstract: An integrated magnetic module includes a first auxiliary circuit board, a second auxiliary circuit board, a first transformer, a second transformer and at least one inductor. The second auxiliary circuit board and the first auxiliary circuit board are arranged side by side. The first transformer is disposed on the first auxiliary circuit board. The second transformer is disposed on the second auxiliary circuit board. The at least one inductor is arranged between the first transformer and second transformer, and electrically connected with the first auxiliary circuit board and the second auxiliary circuit board.

Abstract translation: 集成磁性模块包括第一辅助电路板，第二辅助电路板，第一变压器，第二变压器和至少一个电感器。 第二辅助电路板和第一辅助电路板并排布置。 第一变压器设置在第一辅助电路板上。 第二变压器设置在第二辅助电路板上。 所述至少一个电感器设置在所述第一变压器和所述第二变压器之间，并且与所述第一辅助电路板和所述第二辅助电路板电连接。

公开(公告)号：US09287036B2

公开(公告)日：2016-03-15

申请号：US14088035

申请日：2013-11-22

Applicant: ABB TECHNOLOGY AG

Inventor： Benjamin Weber ,  Bhavesh Patel ,  Jens Tepper ,  Udo Chudobba

IPC: H01F21/12 ,  H01F27/28 ,  H01F21/02 ,  H01F27/30 ,  H01F29/02 ,  H01H9/00

CPC classification number: H01F27/303 ,  H01F29/02 ,  H01H9/0005

Abstract: A transformer winding and a dry-transformer are disclosed, which include a main transformer winding, and a supplementary transformer winding configured to be electrically connected in series with the main transformer winding. The supplementary transformer winding can include a first winding module, a second winding module, and a third winding module, each of the winding modules having at least a first, a second and a third winding segment, and wherein each of the winding segments has a tap. A changer is configured to be connected to the taps of the second winding module, and wherein the second winding module is configured to be electrically connected in series to at least one winding segment of the first winding module and the third winding module.

Abstract translation: 公开了一种变压器绕组和干式变压器，其包括主变压器绕组和被配置为与主变压器绕组串联电连接的辅助变压器绕组。 辅助变压器绕组可以包括第一绕组模块，第二绕组模块和第三绕组模块，每个绕组模块具有至少第一，第二和第三绕组段，并且其中每个绕组段具有 点击。 变换器被配置为连接到第二绕组模块的抽头，并且其中第二绕组模块被构造成与第一绕组模块和第三绕组模块的至少一个绕组段串联电连接。

公开(公告)号：US20150213948A1

公开(公告)日：2015-07-30

申请号：US14596446

申请日：2015-01-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KAZUYUKI SAKIYAMA ,  AKIRA KATO ,  TAKEHIKO YAMAKAWA ,  EIJI TAKAHASHI

IPC: H01F27/28 ,  H01F27/30 ,  H02M7/04

CPC classification number: H01F27/2847 ,  H01F27/303 ,  H01F27/306 ,  H01F41/061

Abstract: A coil structure includes a conductor band and a first insulating plate. The conductor band turns around a coil axis in such a manner that the conductor band folds at a plurality of portions which form a plurality of folded portions. The first insulating plate includes a first edge portion which abuts along at least one of the plurality of folded portions. At least part of the conductor band is wound around the first insulating plate.

Abstract translation: 线圈结构包括导体带和第一绝缘板。 导体带绕线圈轴线转动，使得导体带在形成多个折叠部分的多个部分处折叠。 第一绝缘板包括沿多个折叠部分中的至少一个邻接的第一边缘部分。 导体带的至少一部分缠绕在第一绝缘板上。