公开(公告)号：US20250038010A1

公开(公告)日：2025-01-30

申请号：US18710783

申请日：2022-11-15

Applicant: CORNING INCORPORATED

Inventor： Bomi Kim ,  Joo Sok Kim ,  Hyung Soo Moon ,  Seong-ho Seok

IPC: H01L21/48 ,  H01L21/02 ,  H01L21/768 ,  H01L23/15 ,  H01L23/48

Abstract: A via includes a substrate, a seed layer, and an electroplated layer. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a tapered through-hole extending from the first surface to the second surface. The seed layer includes copper contacting the substrate on sidewalls of the tapered through-hole. The electroplated layer includes copper contacting the seed layer.