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    GLASS-BASED INTEGRATED CIRCUIT PACKAGES FOR COMPOUND MICROELECTRONIC COMPONENTS OPERATING AT MILLIMETER WAVE (MMWAVE) FREQUENCIES
    2.
    发明申请
    GLASS-BASED INTEGRATED CIRCUIT PACKAGES FOR COMPOUND MICROELECTRONIC COMPONENTS OPERATING AT MILLIMETER WAVE (MMWAVE) FREQUENCIES 有权

    公开(公告)号：US20240395644A1

    公开(公告)日：2024-11-28

    申请号：US18669819

    申请日：2024-05-21

    Applicant: CORNING INCORPORATED

    Inventor： Choonkon Kim ,  Hyung Soo Moon ,  Jong-min Yook

    IPC: H01L23/15 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

    Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a glass substrate with a glass cladding layer fused to a glass core layer. The glass substrate includes a cavity with a floor defined by the glass core layer and a sidewall defined by the glass cladding layer. The integrated circuit package further includes a metal layer configured to define a continuous path of thermally and electrically conductive material. The metal layer is disposed within the cavity and along a first surface of the glass cladding layer. The first surface faces opposite an interface between the glass core layer and the glass cladding layer. The integrated circuit package further includes an integrated circuit chip disposed within the cavity and contacting a portion of the metal layer within the cavity. The metal layer provides thermal and electrical connection to a bottom (encapsulated) side of the integrated circuit chip.

    3D PRINTED LAYERED GLASS STRUCTURE HAVING INCREASED MECHANICAL STRENGTH
    3.
    发明申请
    3D PRINTED LAYERED GLASS STRUCTURE HAVING INCREASED MECHANICAL STRENGTH 有权

    公开(公告)号：US20240383795A1

    公开(公告)日：2024-11-21

    申请号：US18695953

    申请日：2022-09-20

    Applicant: CORNING INCORPORATED

    Inventor： Soon-yong Choi ,  EunHwa Kim ,  Hyung Soo Moon

    IPC: C03B23/203 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C03B19/06

    Abstract: A layered glass structure includes an inner layer having opposing major surfaces. The inner layer includes a first glass powder and a first inorganic filler. The inner layer has a first coefficient of thermal expansion (CTE) and a first transition temperature (Tg). An outer layer is disposed on each opposing major surface of the inner layer. The outer layer includes a second glass powder and a second inorganic filler. The outer layer has a second CTE and a second Tg. A CTE gap between the first CTE and the second CTE is between 10×10−7/° C. and 30×10−7/° C. A difference between the first Tg and the second Tg is 10° C. or less.

    LAMINATES AND METHODS OF MAKING THE SAME
    4.
    发明公开
    LAMINATES AND METHODS OF MAKING THE SAME 审中-公开

    公开(公告)号：US20240084437A1

    公开(公告)日：2024-03-14

    申请号：US18263419

    申请日：2022-02-09

    Applicant: CORNING INCORPORATED

    Inventor： Young Suk Lee ,  Hyung Soo Moon ,  Seong-ho Seok

    IPC: C23C14/08 ,  C23C14/14 ,  C23C14/58 ,  C23C28/00

    CPC classification number: C23C14/083 ,  C23C14/14 ,  C23C14/5806 ,  C23C28/3455

    Abstract: A laminate can comprise an oxide disposed over a first major surface of a substrate. The oxide layer can comprise a thickness of about 40 nanometers or less. The oxide layer can comprise oxygen and a first element. The first element can comprise at least one of titanium, tantalum, silicon, or aluminum. The oxide layer can comprise an atomic ratio of oxygen to the another element of about 1.5 or less. The laminate can comprise a peel strength between the substrate and the oxide layer of about 1.3 Newtons per centimeter or more. Methods of making a laminate can comprise providing a substrate comprising a first major surface and depositing an oxide layer over the first major surface of the substrate by sputtering from an elemental target comprising an another element in an oxygen environment.

    FREQUENCY SELECTIVE SUBSTRATE ASSEMBLIES
    6.
    发明申请
    FREQUENCY SELECTIVE SUBSTRATE ASSEMBLIES 有权

    公开(公告)号：US20240396196A1

    公开(公告)日：2024-11-28

    申请号：US18713767

    申请日：2022-11-18

    Applicant: CORNING INCORPORATED

    Inventor： Hyeng-cheul Choi ,  Byounggwan Kang ,  Choonkon Kim ,  Hyung Soo Moon

    IPC: H01P1/20 ,  B32B7/02 ,  B32B7/12 ,  B32B17/06

    Abstract: A substrate assembly includes a first substrate and a second substrate each comprising an inner surface opposite an outer surface, a conductive material layer disposed on the inner surface of the second substrate, and an adhesive layer disposed between the inner surface of the first substrate and the inner surface of the second substrate such that the conductive material layer is positioned between the inner surface of the second substrate and the adhesive layer and the adhesive layer bonds the first substrate to the second substrate, wherein the substrate assembly comprises a reflection coefficient of 0.7 or less.

    MICROSTRUCTURED AND PATTERNED LIGHT GUIDE PLATES AND DEVICES COMPRISING THE SAME
    8.
    发明申请
    MICROSTRUCTURED AND PATTERNED LIGHT GUIDE PLATES AND DEVICES COMPRISING THE SAME 审中-公开

    公开(公告)号：US20190146139A1

    公开(公告)日：2019-05-16

    申请号：US16308691

    申请日：2017-06-09

    Applicant: CORNING INCORPORATED

    Inventor： Byungyun Joo ,  Hyunbin Kim ,  Yunyoung Kwon ,  Hyung Soo Moon

    IPC: F21V8/00

    Abstract: Disclosed herein are light guide plates (100) comprising a transparent substrate (110) having an edge surface, a light emitting first major surface, and an opposing second major surface; and a polymeric film (120) disposed on the second major surface of the transparent substrate, wherein the polymeric film comprises a plurality of microstructures (130) patterned with a plurality of light extraction features (135). At least one light source may be coupled to the edge surface of the transparent substrate. Display and lighting devices comprising such light guide plates are further disclosed, as well as methods for manufacturing such light guide plates.

    Multi-composition glass structures via 3D printing
    9.
    发明授权
    Multi-composition glass structures via 3D printing 有权

    公开(公告)号：US11975997B2

    公开(公告)日：2024-05-07

    申请号：US17215240

    申请日：2021-03-29

    Applicant: CORNING INCORPORATED

    Inventor： Soon-yong Choi ,  EunHwa Kim ,  Hyung Soo Moon

    IPC: C03B19/01 ,  C03C3/087 ,  C04B35/634 ,  C04B41/00

    CPC classification number: C03B19/01 ,  C03C3/087 ,  C04B35/634 ,  C04B41/0072 ,  C04B2235/60

    Abstract: A method of producing a glass structure includes forming a green body having an inner layer of a first powder of a first glass composition in a first organic material matrix and an outer layer of a second powder of a second glass composition in a second organic material matrix, the outer layer covering at least two opposing major surfaces or all surfaces of the inner layer, the first glass composition being different from the second glass composition, the first and second powders having respective first and second sintering temperatures, the second sintering temperature being within 0 to 30° C. of the first sintering temperature; and debinding and sintering the green body to remove the organic materials and to sinter together the first and second glass powders to produce a sintered glass structure having an inner layer of the first glass composition and an outer layer of the second glass composition.

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