公开(公告)号：US20240084437A1

公开(公告)日：2024-03-14

申请号：US18263419

申请日：2022-02-09

Applicant: CORNING INCORPORATED

Inventor： Young Suk Lee ,  Hyung Soo Moon ,  Seong-ho Seok

IPC: C23C14/08 ,  C23C14/14 ,  C23C14/58 ,  C23C28/00

CPC classification number: C23C14/083 ,  C23C14/14 ,  C23C14/5806 ,  C23C28/3455

Abstract: A laminate can comprise an oxide disposed over a first major surface of a substrate. The oxide layer can comprise a thickness of about 40 nanometers or less. The oxide layer can comprise oxygen and a first element. The first element can comprise at least one of titanium, tantalum, silicon, or aluminum. The oxide layer can comprise an atomic ratio of oxygen to the another element of about 1.5 or less. The laminate can comprise a peel strength between the substrate and the oxide layer of about 1.3 Newtons per centimeter or more. Methods of making a laminate can comprise providing a substrate comprising a first major surface and depositing an oxide layer over the first major surface of the substrate by sputtering from an elemental target comprising an another element in an oxygen environment.

公开(公告)号：US20250038010A1

公开(公告)日：2025-01-30

申请号：US18710783

申请日：2022-11-15

Applicant: CORNING INCORPORATED

Inventor： Bomi Kim ,  Joo Sok Kim ,  Hyung Soo Moon ,  Seong-ho Seok

IPC: H01L21/48 ,  H01L21/02 ,  H01L21/768 ,  H01L23/15 ,  H01L23/48

Abstract: A via includes a substrate, a seed layer, and an electroplated layer. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a tapered through-hole extending from the first surface to the second surface. The seed layer includes copper contacting the substrate on sidewalls of the tapered through-hole. The electroplated layer includes copper contacting the seed layer.

公开(公告)号：US20250157812A1

公开(公告)日：2025-05-15

申请号：US18947441

申请日：2024-11-14

Applicant: CORNING INCORPORATED

Inventor： Jason Roy Grenier ,  Sung-Il Kim ,  Han-Kyom Lee ,  Daniel Wayne Levesque, JR. ,  Robert Anthony Schaut ,  Seong-ho Seok

IPC: H01L21/02 ,  H01L21/306 ,  H01L21/768

Abstract: Methods for forming a through-glass vias in glass-based substrates include irradiating a glass-based substrate with a laser beam to form a damage track extending from a first major surface to a second major surface of the glass-based substrate, and contacting the glass-based substrate with a first etchant, including a base, to form a preliminary through-glass via. The method includes contacting the glass-based substrate with a second etchant, including an acid. The contacting with the second etchant widens a first cross-sectional area of the preliminary through-glass via at the first major surface of the glass-based substrate and widens a second cross-sectional area of the preliminary through-glass via at the second major surface of the glass-based substrate.