公开(公告)号：US11260646B2

公开(公告)日：2022-03-01

申请号：US16349845

申请日：2017-11-13

Applicant: CORNING INCORPORATED

Inventor： Christina Sue Bennett ,  Raymond Charles Cady ,  Hyun-Soo Choi ,  Claire Renata Coble ,  Byungchul Kim ,  Timothy Michael Miller ,  Joseph William Soper ,  Gary Carl Weber

IPC: B32B43/00 ,  B32B38/18 ,  B32B38/00

Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.

公开(公告)号：US20190275782A1

公开(公告)日：2019-09-12

申请号：US16349845

申请日：2017-11-13

Applicant: CORNING INCORPORATED

Inventor： Christina Sue Bennett ,  Raymond Charles Cady ,  Hyun-Soo Choi ,  Claire Renata Coble ,  Byungchul Kim ,  Timothy Michael Miller ,  Joseph William Soper ,  Gary Carl Weber

IPC: B32B43/00 ,  B32B38/18

Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.