公开(公告)号：US11260646B2

公开(公告)日：2022-03-01

申请号：US16349845

申请日：2017-11-13

Applicant: CORNING INCORPORATED

Inventor： Christina Sue Bennett ,  Raymond Charles Cady ,  Hyun-Soo Choi ,  Claire Renata Coble ,  Byungchul Kim ,  Timothy Michael Miller ,  Joseph William Soper ,  Gary Carl Weber

IPC: B32B43/00 ,  B32B38/18 ,  B32B38/00

Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.

公开(公告)号：US12234175B1

公开(公告)日：2025-02-25

申请号：US18677404

申请日：2024-05-29

Applicant: CORNING INCORPORATED

Inventor： Richard Dominic Bomba ,  Cyril Rémy André Dedieu ,  Arnaud Dominique Dejean ,  Allan Mark Fredholm ,  Anne-Claire Jeanson ,  David John McEnroe ,  Mathieu Mondésir ,  Galan Gregory Moore ,  Aniello Mario Palumbo ,  David Sampaio ,  Thomas Matthew Sonner ,  Joseph William Soper

IPC: C03B11/10 ,  C03B11/12 ,  C03C3/083

Abstract: The present disclosure is directed to methods and techniques for gob-pressing a glass part of challenging geometries, such as large surfaces with thin thickness as well as features positioned far from a centroid of the part.

公开(公告)号：US20190275782A1

公开(公告)日：2019-09-12

申请号：US16349845

申请日：2017-11-13

Applicant: CORNING INCORPORATED

Inventor： Christina Sue Bennett ,  Raymond Charles Cady ,  Hyun-Soo Choi ,  Claire Renata Coble ,  Byungchul Kim ,  Timothy Michael Miller ,  Joseph William Soper ,  Gary Carl Weber

IPC: B32B43/00 ,  B32B38/18

Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.