公开(公告)号：US20220401952A1

公开(公告)日：2022-12-22

申请号：US17763804

申请日：2020-09-30

Applicant: CORNING INCORPORATED

Inventor： George Edward Berkey ,  Alexander Lee Cuno ,  John Walter Grunden ,  Kyler Robert Hurlburt ,  Yanxia Ann Lu ,  James Scott Sutherland ,  Oscar Walter Wheeler

IPC: B01L3/00 ,  C04B35/645

Abstract: A module and a process for forming a monolithic substantially closed-porosity silicon carbide fluidic module having a tortuous fluid passage extending through the module, the tortuous fluid passage having an interior surface, the interior surface having a surface roughness in the range of from 0.1 to 10 μm Ra. The process includes positioning a positive fluid passage mold within a volume of silicon carbide powder, the powder coated with a binder; pressing the volume of silicon carbide powder with the mold inside to form a pressed body; heating the pressed body to remove the mold; and sintering the pressed body.

公开(公告)号：US20250011246A1

公开(公告)日：2025-01-09

申请号：US18706423

申请日：2022-11-02

Applicant: CORNING INCORPORATED

Inventor： Alexander Lee Cuno ,  Thierry Luc Alain Dannoux ,  John Walter Grunden ,  Yanxia Ann Lu ,  James Scott Sutherland

IPC: C04B38/00 ,  C04B35/565 ,  C04B35/622

Abstract: A fluidic module includes a monolithic closed-porosity ceramic body that has a first region and a second region with the first region disposed between the second region. The first and second regions are configured to differ from one another with respect to a common attribute of a ceramic material of the ceramic body. The common attribute can differ by forming the first and second regions from ceramic particles that differ with respect their particle sizes. The fluidic module further includes a tortuous fluid passage that extends through the ceramic body. The fluid passage is surrounded by the first region such that the fluid passage is separated entirely from the second region at least within a planar region of the ceramic body. The fluid passage has an interior surface with a surface roughness of less than or equal to 5 μm Ra. A method for forming the fluidic module is disclosed.