公开(公告)号：US20210206145A1

公开(公告)日：2021-07-08

申请号：US17212533

申请日：2021-03-25

Applicant: CORNING INCORPORATED

Inventor： Polly Wanda CHU ,  Michael Patrick Donovan ,  Timothy Michael Gross ,  Louis Mattos, JR. ,  Prakash Chandra Panda ,  Robert Lee Smith, III

IPC: B32B17/06 ,  G06F1/16 ,  H01L51/00 ,  B32B7/12 ,  B32B17/10 ,  G09F9/30 ,  G02F1/1333 ,  B32B3/16

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress σI of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress σB at the first primary surface in tension, σI+σB