公开(公告)号：US20210206145A1

公开(公告)日：2021-07-08

申请号：US17212533

申请日：2021-03-25

Applicant: CORNING INCORPORATED

Inventor： Polly Wanda CHU ,  Michael Patrick Donovan ,  Timothy Michael Gross ,  Louis Mattos, JR. ,  Prakash Chandra Panda ,  Robert Lee Smith, III

IPC: B32B17/06 ,  G06F1/16 ,  H01L51/00 ,  B32B7/12 ,  B32B17/10 ,  G09F9/30 ,  G02F1/1333 ,  B32B3/16

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress σI of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress σB at the first primary surface in tension, σI+σB

公开(公告)号：US20190255815A1

公开(公告)日：2019-08-22

申请号：US16333496

申请日：2017-09-13

Applicant: Corning Incorporated

Inventor： Louis Mattos, JR.

IPC: B32B17/10 ,  B32B5/16 ,  B32B17/06

Abstract: A method includes pressing a stack including a glass sheet and an uncured non glass mat at a pressing pressure and a pressing temperature, whereby the uncured non¬glass mat is cured and bonded to the glass sheet to form a glass laminate including the glass sheet bonded to a non glass substrate. Another method includes pressing a stack including a glass sheet and a plurality of uncured polymer impregnated papers at a pressing pressure and a pressing temperature, whereby the plurality of uncured polymer impregnated papers is cured to form a non glass substrate and bonded to the glass sheet to form a glass laminate.

公开(公告)号：US20190160790A1

公开(公告)日：2019-05-30

申请号：US16098337

申请日：2017-05-02

Applicant: Corning Incorporated

Inventor： Jean-Marc Martin Gerard Jouanno ,  Louis Mattos, JR.

IPC: B32B17/06 ,  B32B7/12 ,  B32B15/12 ,  B32B15/08 ,  B44C5/04 ,  B44F1/06

Abstract: A laminated glass structure is provided that includes a non-glass substrate, a flexible glass sheet, and an adhesive. The non-glass substrate includes one or more layers of polymer-impregnated paper, an upper primary surface and a lower primary surface. The non-glass substrate also comprises an upper moisture barrier at a selected depth from the upper primary surface. The flexible glass sheet has a thickness of no greater than 0.3 mm and is laminated to the upper primary surface of the non-glass substrate with the adhesive. An optional lower moisture barrier can also be included within the non-glass substrate at a selected depth from the lower primary surface. Further, the non-glass substrate may be preconditioned at 70 C for 96 hours or more prior to lamination of the flexible glass sheet to the upper primary surface of the non-glass substrate.

公开(公告)号：US20190011954A1

公开(公告)日：2019-01-10

申请号：US16119565

申请日：2018-08-31

Applicant: CORNING INCORPORATED

Inventor： Polly Wanda Chu ,  Michael Patrick Donovan ,  Timothy Michael Gross ,  Louis Mattos, JR. ,  Prakash Chandra Panda ,  Robert Lee Smith, III

IPC: G06F1/16 ,  G09F9/30 ,  B32B17/10

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress σI of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress σB at the first primary surface in tension, σI+σB

公开(公告)号：US20190275767A1

公开(公告)日：2019-09-12

申请号：US16345025

申请日：2017-10-24

Applicant: CORNING INCORPORATED

Inventor： Polly Wanda Chu ,  Timothy Michael Gross ,  Louis Mattos, JR. ,  Timothy Paul Smith

IPC: B32B17/06 ,  B32B17/10

Abstract: A stack assembly including a glass element having a thickness of less than or equal to 200 microns, and a first layer supporting the glass element. The glass element having a first pen drop height value when directly adjacent on a solid aluminum stage. The first layer having a stiffness of from 9×105 N/m to 2.0×106 N/m. When the glass element is supported by the first layer on the aluminum stage, the glass element comprises a second pen drop height value, wherein the second pen drop height value is greater than the first pen drop height value.

公开(公告)号：US20190022980A1

公开(公告)日：2019-01-24

申请号：US16069959

申请日：2017-01-13

Applicant: CORNING INCORPORATED

Inventor： Polly Wanda Chu ,  Michael Patrick Donovan ,  Timothy Michael Gross ,  Louis Mattos, JR. ,  Prakash Chandra Panda ,  Robert Lee Smith, III

IPC: B32B17/06 ,  B32B7/12 ,  H01L51/00

CPC classification number: B32B17/064 ,  B32B3/16 ,  B32B7/12 ,  B32B17/1055 ,  B32B2255/10 ,  B32B2307/536 ,  B32B2307/546 ,  B32B2315/08 ,  B32B2457/00 ,  B32B2457/20 ,  G02F1/133305 ,  G06F1/1641 ,  G06F1/1652 ,  G09F9/301 ,  H01L51/0097 ,  H01L2251/5338 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/266

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress σI of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress σB at the first primary surface in tension, σI+σB