公开(公告)号：US20230416138A1

公开(公告)日：2023-12-28

申请号：US18036802

申请日：2021-11-10

Applicant: CORNING INCORPORATED

Inventor： Woo Jin Lee

IPC: C03B33/07 ,  C03B33/10 ,  B24B9/08

CPC classification number: C03B33/076 ,  C03B33/105 ,  B24B9/08

Abstract: Provided is an apparatus for cutting a glass laminated substrate, the apparatus including a first rotating plate, a second rotating plate, and a connection member interposed between the first rotating plate and the second rotating plate and configured to rotate around the first axis, in which a channel having a ring shape surrounding an outer circumferential surface of the connection member is formed between the first rotating plate and the second rotating plate.

公开(公告)号：US20230311219A1

公开(公告)日：2023-10-05

申请号：US18023908

申请日：2021-08-20

Applicant: CORNING INCORPORATED

Inventor： Woo Jin Lee

IPC: B23B41/06 ,  C03B33/07

CPC classification number: B23B41/06 ,  C03B33/07 ,  B23B2226/45

Abstract: Provided is a hole cutting apparatus for forming a hole in a glass laminate substrate including a substrate, an adhesive layer, and the glass layer which are sequentially stacked. The apparatus includes a rotatable body, and a cutter coupled to a lower portion of the body, configured to form a hole in the glass layer by cutting the glass layer and at least a part of the adhesive layer and to deburr a surface of the hole, and including a cutting portion having a cross-sectional area in a horizontal direction that gradually decreases in a downward direction.

公开(公告)号：US20220356106A1

公开(公告)日：2022-11-10

申请号：US17636070

申请日：2020-08-07

Applicant: CORNING INCORPORATED

Inventor： Woo Jin Lee ,  Cheol Hee Park ,  Dong Keun Shin

IPC: C03B33/07 ,  C03B33/03

Abstract: Provided are an apparatus and method for cutting a glass laminate The apparatus comprises a first and second part spaced apart from each other by a first gap, a first guide block and a second guide block spaced apart from each other by a second gap, wherein a saw blade is able to pass through first and second gaps, a first fixing unit and second fixing unit, each capable of fixing the respective first guide block and second guide block to the respective first part and second part of the table, and thus defining a space for a glass laminate.

公开(公告)号：US20240109165A1

公开(公告)日：2024-04-04

申请号：US18268010

申请日：2021-12-07

Applicant: CORNING INCORPORATED

Inventor： Woo Jin Lee ,  Jongsup Yeom

IPC: B24C1/04

CPC classification number: B24C1/045

Abstract: An apparatus for cutting a composite substrate includes a support configured to support a composite substrate including a first layer and a second layer that includes a material different from the first layer, a water jet nozzle configured to eject high-pressure water to cut the composite substrate and move along an upper surface of the support, a jet pressure controller configured to control a pressure of the high-pressure water ejected from the water jet nozzle, and a motion controller configured to control a movement of the water jet nozzle.

公开(公告)号：US20240051287A1

公开(公告)日：2024-02-15

申请号：US18267984

申请日：2021-12-07

Applicant: CORNING INCORPORATED

Inventor： Eunho Lee ,  Woo Jin Lee ,  Jongsup Yeom

IPC: B32B43/00 ,  B32B38/16 ,  B32B38/00

CPC classification number: B32B43/003 ,  B32B38/162 ,  B32B38/164 ,  B32B38/105

Abstract: An apparatus for manufacturing a glass laminated substrate includes a chamber, a cutting apparatus configured to cut the glass laminated substrate within the chamber, and a surface processing apparatus configured to process a surface of the glass laminated substrate that is cut. The cutting apparatus and the surface processing apparatus of the apparatus for manufacturing a glass laminated substrate can be used to manufacture in-line the glass laminated substrate within the chamber.

公开(公告)号：US20240033964A1

公开(公告)日：2024-02-01

申请号：US18039999

申请日：2021-11-30

Applicant: CORNING INCORPORATED

Inventor： Woo Jin Lee

IPC: B26D7/01

CPC classification number: B26D7/015

Abstract: A chucking assembly includes a chucking plate having an upper surface, a lower surface, and a chucking recess in the lower surface, a lever on the upper surface of the chucking plate, a piston, a chucking pad, and an elastic member connected to the piston in the chucking recess of the chucking plate and configured to provide an elastic force to the chucking pad based on a movement of the piston.

公开(公告)号：US20220161369A1

公开(公告)日：2022-05-26

申请号：US17432648

申请日：2020-03-05

Applicant: CORNING INCORPORATED

Inventor： Joo Sok Kim ,  Woo Jin Lee ,  Cheol Hee Park ,  Michael William Price ,  Dong Keun Shin ,  Yuyin Tang

IPC: B23K26/402 ,  B23K26/38 ,  B23K37/00 ,  B23K26/14 ,  B23K26/142 ,  C03B33/07 ,  C03B33/09

Abstract: A method of processing a glass laminate substrate includes carrying a glass laminate substrate including a glass substrate on a metal substrate to a processing location; radiating a laser onto the metal substrate through the glass substrate; and cooling a portion of the glass substrate, through which the laser is radiated, such that the glass substrate is cut at the portion through which the laser is radiated. When methods of processing and cutting a glass laminate substrate and an apparatus for processing a glass laminate substrate, according to embodiments, are used, a glass laminate substrate having high edge strength after cutting may be produced.