公开(公告)号：US20230116816A1

公开(公告)日：2023-04-13

申请号：US17961897

申请日：2022-10-07

Applicant: CORNING INCORPORATED

Inventor： Yen-Kai Huang ,  Bernhard Anton Moegele ,  Uwe Stute ,  Ralf Joachim Terbrueggen

IPC: C03B33/02 ,  C03B33/08 ,  B23K26/21

Abstract: A method including emitting a laser beam toward a transparent workpiece such that portions of the laser beam pass through openings of a beam shaping structure and form corresponding laser beam focal lines across the transparent workpiece. The laser beam focal lines forming a plurality of defects in the transparent workpiece disposed along a contour line. The method further including separating the transparent workpiece along the contour line to provide a first workpiece section and a second workpiece section and a cut edge surface on each of the first and second workpiece sections, each cut edge including a defect region and an unaffected region. The defect region having a higher surface roughness than the unaffected region and a minimum distance of the unaffected region to the first major surface being about 20% or less of a thickness between the first major surface and the second major surface.