公开(公告)号：US20230116816A1

公开(公告)日：2023-04-13

申请号：US17961897

申请日：2022-10-07

Applicant: CORNING INCORPORATED

Inventor： Yen-Kai Huang ,  Bernhard Anton Moegele ,  Uwe Stute ,  Ralf Joachim Terbrueggen

IPC: C03B33/02 ,  C03B33/08 ,  B23K26/21

Abstract: A method including emitting a laser beam toward a transparent workpiece such that portions of the laser beam pass through openings of a beam shaping structure and form corresponding laser beam focal lines across the transparent workpiece. The laser beam focal lines forming a plurality of defects in the transparent workpiece disposed along a contour line. The method further including separating the transparent workpiece along the contour line to provide a first workpiece section and a second workpiece section and a cut edge surface on each of the first and second workpiece sections, each cut edge including a defect region and an unaffected region. The defect region having a higher surface roughness than the unaffected region and a minimum distance of the unaffected region to the first major surface being about 20% or less of a thickness between the first major surface and the second major surface.

公开(公告)号：US20220098082A1

公开(公告)日：2022-03-31

申请号：US17477940

申请日：2021-09-17

Applicant: CORNING INCORPORATED

Inventor： Alejandro Antonio Becker ,  Benjamin Paul Foerg ,  Tobias Christian Roeder ,  Uwe Stute

IPC: C03B33/07 ,  C03B33/02 ,  B23K26/362 ,  B23K26/402

Abstract: A method of laser processing a coated substrate having a coating later disposed on a transparent workpiece that includes determining an optical characteristic of the coating layer and selecting a beam path for a pulsed laser beam based on the optical characteristic. The beam path is selected a polarization-adjusting beam path and a frequency-adjusting beam path. The method also includes directing the pulsed laser beam down the selected beam path to form a modified pulsed laser beam and directing the modified pulsed laser beam into the transparent workpiece, where the modified pulsed laser beam forms a laser beam focal line that induces absorption in the transparent workpiece to produce a defect in the transparent workpiece. The laser beam focal line includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ ⁢ w o 2 λ , where FD is a dimensionless divergence factor.

公开(公告)号：US20220339751A1

公开(公告)日：2022-10-27

申请号：US17621049

申请日：2020-06-11

Applicant: CORNING INCORPORATED

Inventor： Jonas Bankaitis ,  Duc Anh Bui ,  Scott Steven Cronk ,  Christopher Paul Daigler ,  Christina Marie Laskowski ,  Neil Eugene Partridge ,  Uwe Stute ,  Sergio Tsuda ,  Chad Michael Wilcox

IPC: B24B9/10

Abstract: Processes and devices by which a brittle material substrate may be edge formed and finished to simultaneously remove corresponding damage remaining on the edges in the areas formed by cutting and separation while imposing a desired edge profile and achieving a desired mechanical edge strength. Processes of the present disclosure may include a chemical and mechanical brush polishing process configured to shape and/or polish a surface of one or more thin substrates. A plurality of substrates may be arranged in a stacked configuration, and engineered interposer devices may be arranged between the stacked substrates. The interposers may provide between the substrates and may direct filament placement during brushing so as to guide material removal on the substrate edges. Substrate edge profile shapes, including symmetric and asymmetric profiles, may be formed by strategic manipulation of interposer properties including dimensions, mechanical features, material properties, and positioning.

公开(公告)号：US20190300417A1

公开(公告)日：2019-10-03

申请号：US16362110

申请日：2019-03-22

Applicant: Corning Incorporated

Inventor： Uwe Stute

IPC: C03B33/02 ,  C03B33/10 ,  B23K26/40 ,  B23K26/364

Abstract: A method for processing a transparent workpiece comprises forming an optically modified region in or on a transparent workpiece and forming a contour in the transparent workpiece, the contour comprising a plurality of defects in the transparent workpiece positioned laterally offset from the optically modified region. Forming the contour comprises directing a primary laser beam comprising a quasi-non diffracting beam oriented along a beam pathway onto the transparent workpiece such that a first caustic portion of the primary laser beam is directed into the transparent workpiece, thereby generating an induced absorption within the transparent workpiece to produce a defect within the transparent workpiece and a second caustic portion of the primary laser beam is modified by the optically modified region. Further, translating the transparent workpiece and the primary laser beam relative to each other along a contour line and laterally offset from the optically modified region.

公开(公告)号：US20200049552A1

公开(公告)日：2020-02-13

申请号：US16536559

申请日：2019-08-09

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Tobias Christian Roeder ,  Uwe Stute

IPC: G01J1/42 ,  G01J1/44 ,  G01B11/28 ,  B23K26/073 ,  B23K26/53

Abstract: A laser system includes a controller comprising a processor and a non-transitory machine-readable memory, a laser head configured to output a laser beam, a work bed positioned opposite the laser head, and a power meter communicatively coupled to the electronic control unit and integrated within the work bed. The laser system further includes a knife edge plate positioned between the power meter and the laser head, and a machine-readable instruction set stored in the non-transitory machine readable memory that causes the laser system to perform at least the following when executed by the processor: position the laser head at a distance from the power meter, cause the laser head to output the laser beam, translate the laser head across the power meter, receive power signals from the power meter as the laser beam is translated across the power meter, and calculate a spot size based on the power signals.

公开(公告)号：US20190047894A1

公开(公告)日：2019-02-14

申请号：US16057284

申请日：2018-08-07

Applicant: Corning Incorporated

Inventor： Marina Irmgard Heiss ,  Uwe Stute ,  Ralf Joachim Terbrueggen

IPC: C03B33/02 ,  C03B33/09 ,  B23K26/364

Abstract: A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other.

公开(公告)号：US12186835B2

公开(公告)日：2025-01-07

申请号：US17330896

申请日：2021-05-26

Applicant: CORNING INCORPORATED

Inventor： Sandra Hoehm ,  Uwe Stute

IPC: B23K26/53 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/073 ,  B23K26/082 ,  B23K26/18 ,  B23K101/34 ,  B23K103/00

Abstract: A method of separating a coated substrate includes directing an infrared laser beam onto a first surface of the coated substrate. The coated substrate includes a coating layer disposed on a transparent workpiece, a plurality of defects is disposed within the coated substrate along a contour line that divides a primary region from a dummy region of the coated substrate from a dummy region of the coated substrate. The method also includes translating at least one of the coated substrate and the infrared laser beam relative to each other such that an infrared beam spot traces an oscillating pathway that follows an offset line in a translation direction and oscillates between an inner and outer track line, the oscillating pathway is disposed on the dummy region of the coated substrate, and the infrared laser beam applies thermal energy to the plurality of defects to induce separation of the coated substrate.

公开(公告)号：US20210387288A1

公开(公告)日：2021-12-16

申请号：US17330896

申请日：2021-05-26

Applicant: CORNING INCORPORATED

Inventor： Sandra Hoehm ,  Uwe Stute

IPC: B23K26/53 ,  B23K26/082 ,  B23K26/073 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/18 ,  B23K101/34 ,  B23K103/00

Abstract: A method of separating a coated substrate includes directing an infrared laser beam onto a first surface of the coated substrate. The coated substrate includes a coating layer disposed on a transparent workpiece, a plurality of defects is disposed within the coated substrate along a contour line that divides a primary region from a dummy region of the coated substrate from a dummy region of the coated substrate. The method also includes translating at least one of the coated substrate and the infrared laser beam relative to each other such that an infrared beam spot traces an oscillating pathway that follows an offset line in a translation direction and oscillates between an inner and outer track line, the oscillating pathway is disposed on the dummy region of the coated substrate, and the infrared laser beam applies thermal energy to the plurality of defects to induce separation of the coated substrate.

公开(公告)号：US20210122663A1

公开(公告)日：2021-04-29

申请号：US17144858

申请日：2021-01-08

Applicant: Corning Incorporated

Inventor： Marina Irmgard Heiss ,  Uwe Stute ,  Ralf Joachim Terbrueggen

IPC: C03B33/02 ,  B23K26/06 ,  B23K26/073 ,  B23K26/082 ,  B23K26/067 ,  B23K26/53 ,  B23K26/364 ,  C03B33/09

Abstract: A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other.

公开(公告)号：US10982998B2

公开(公告)日：2021-04-20

申请号：US16536559

申请日：2019-08-09

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Tobias Christian Roeder ,  Uwe Stute

IPC: G01J1/42 ,  B23K26/53 ,  B23K26/073 ,  G01B11/28 ,  G01J1/44

Abstract: A laser system includes a controller comprising a processor and a non-transitory machine-readable memory, a laser head configured to output a laser beam, a work bed positioned opposite the laser head, and a power meter communicatively coupled to the electronic control unit and integrated within the work bed. The laser system further includes a knife edge plate positioned between the power meter and the laser head, and a machine-readable instruction set stored in the non-transitory machine readable memory that causes the laser system to perform at least the following when executed by the processor: position the laser head at a distance from the power meter, cause the laser head to output the laser beam, translate the laser head across the power meter, receive power signals from the power meter as the laser beam is translated across the power meter, and calculate a spot size based on the power signals.