公开(公告)号：US11256039B2

公开(公告)日：2022-02-22

申请号：US16850167

申请日：2020-04-16

Applicant: CORNING OPTICAL COMMUNICATIONS LLC

Inventor： Joel Patrick Carberry ,  Minghan Chen ,  Ming-Jun Li ,  Anping Liu ,  Barada Kanta Nayak

IPC: G02B6/38 ,  B23K26/382 ,  B23K26/073 ,  G02B6/25

Abstract: A method of cleaving an optical fiber comprises inserting the optical fiber through a bore of a holding member, securing the optical fiber to the holding member with a bonding agent, operating at least one laser to emit at least one laser beam, and directing the at least one laser beam from the at least one laser to the end face of the holding member. At least a portion of the at least one laser beam reflects off the end face of the holding member and is thereafter incident on an end portion of the optical fiber. The at least one laser beam cleaves the end portion of the optical fiber less than 20 μm from the end face of the holding member. Related systems are also disclosed.

公开(公告)号：US20180059321A1

公开(公告)日：2018-03-01

申请号：US15248026

申请日：2016-08-26

Applicant: Corning Optical Communications LLC

Inventor： Minghan Chen ,  Ming-Jun Li ,  Gaozhu Peng

IPC: G02B6/134 ,  C03C21/00 ,  C03C23/00

CPC classification number: G02B6/1345 ,  C03C21/005 ,  C03C23/0025 ,  C03C23/007 ,  G02B6/122

Abstract: Methods of forming ion-exchanged waveguides in glass substrates are disclosed. In one embodiment, a method of forming a waveguide in an ion-exchanged glass substrate having an ion-exchanged layer extending from a surface to a depth of layer of the ion-exchanged glass substrate includes locally heating at least one band at the surface of the ion-exchanged glass substrate to diffuse ions in the ion-exchanged layer within the at least one band. A concentration of ions within the at least one band is less than a concentration of ions outside of the at least one band, and at least one waveguide is defined within the ion-exchanged layer adjacent the at least one band. In some embodiments, the at least one waveguide is embedded within the ion-exchanged glass substrate such that an upper surface of the at least one waveguide is below the surface of the glass substrate by a depth d.

公开(公告)号：US10197732B2

公开(公告)日：2019-02-05

申请号：US15248026

申请日：2016-08-26

Applicant: Corning Optical Communications LLC

Inventor： Minghan Chen ,  Ming-Jun Li ,  Gaozhu Peng

IPC: G02B6/10 ,  G02B6/134 ,  C03C21/00 ,  C03C23/00 ,  G02B6/122

Abstract: Methods of forming ion-exchanged waveguides in glass substrates are disclosed. In one embodiment, a method of forming a waveguide in an ion-exchanged glass substrate having an ion-exchanged layer extending from a surface to a depth of layer of the ion-exchanged glass substrate includes locally heating at least one band at the surface of the ion-exchanged glass substrate to diffuse ions in the ion-exchanged layer within the at least one band. A concentration of ions within the at least one band is less than a concentration of ions outside of the at least one band, and at least one waveguide is defined within the ion-exchanged layer adjacent the at least one band. In some embodiments, the at least one waveguide is embedded within the ion-exchanged glass substrate such that an upper surface of the at least one waveguide is below the surface of the glass substrate by a depth d.

公开(公告)号：US20200241213A1

公开(公告)日：2020-07-30

申请号：US16850167

申请日：2020-04-16

Applicant: CORNING OPTICAL COMMUNICATIONS LLC

Inventor： Joel Patrick Carberry ,  Minghan Chen ,  Ming-Jun Li ,  Anping Liu ,  Barada Kanta Nayak

IPC: G02B6/38 ,  G02B6/25 ,  B23K26/073 ,  B23K26/382

Abstract: A method of cleaving an optical fiber comprises inserting the optical fiber through a bore of a holding member, securing the optical fiber to the holding member with a bonding agent, operating at least one laser to emit at least one laser beam, and directing the at least one laser beam from the at least one laser to the end face of the holding member. At least a portion of the at least one laser beam reflects off the end face of the holding member and is thereafter incident on an end portion of the optical fiber. The at least one laser beam cleaves the end portion of the optical fiber less than 20 μm from the end face of the holding member. Related systems are also disclosed.