公开(公告)号：US20140126199A1

公开(公告)日：2014-05-08

申请号：US13763270

申请日：2013-02-08

Applicant: CREE, INC.

Inventor： SHAWN HEETER ,  Vasavi Mandavilli ,  Mitchell Huang ,  Mark Edward Dixon ,  Kurt W. Wilcox ,  Nicholas W. Medendorp, JR.

IPC: F21V21/08 ,  F21V21/096 ,  F21V21/088

CPC classification number: F21V21/08 ,  F21K9/27 ,  F21V21/088 ,  F21V21/096

Abstract: Retrofit systems and methods are disclosed for lighting installations, and in particular, to retrofit systems and methods used to retrofit troffer-style lighting installations with LED light sources. Retrofit systems can be used with different light fixtures, but those described are particularly adapted for use with troffer-style fixtures. These retrofit systems can provide the same amount of light as traditional light fixtures already do, for example 1600-4000 lumens or more. The retrofit systems can be used with many different light sources but are particularly well-suited for use with solid state light sources or light engines, such as those utilizing LEDs. Some embodiments of the present invention comprise a mechanical mounting system for installing an LED light engine within an existing lighting system housing or pan, such as a troffer pan, without penetrating the ceiling plenum.

Abstract translation: 公开了用于照明装置的改进系统和方法，特别是改进用于利用LED光源改装路灯式照明装置的系统和方法。 改装系统可以与不同的灯具一起使用，但是所描述的装置特别适用于与套装式灯具一起使用。 这些改造系统可以提供与传统灯具相同的光量，例如1600-4000流明或更多。 改造系统可以与许多不同的光源一起使用，但是特别适用于固态光源或光引擎，例如使用LED的那些。 本发明的一些实施例包括一种机械安装系统，用于将LED光引擎安装在现有的照明系统外壳或平底锅（例如小铲盘）内，而不会穿透天花板增压室。

公开(公告)号：US20160072022A1

公开(公告)日：2016-03-10

申请号：US14478571

申请日：2014-09-05

Applicant: CREE, INC.

Inventor： Theodore Lowes ,  Kurt W. Wilcox ,  Bernd Keller ,  Chandan Bhat

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/46 ,  H01L33/44 ,  H01L33/50 ,  H01L33/58

CPC classification number: H01L33/486 ,  H01L33/44 ,  H01L33/505 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Emitter packages are disclosed that can include an insulating layer covering the emitter, such as between the emitter's primary emission surface and a lens or encapsulant. The packages can comprise a submount with an emitter flip-chip mounted such that the diode region is between the emitter's non-insulating and/or conductive substrate and the submount. The submount can then be covered with a thin insulating layer. The same or another insulating layer can cover other electrically active surfaces on the submount. By insulating the electrically active surfaces of the emitter and, in some embodiments, other electrically active surfaces, the package can meet UL8750 class 4 enclosure standards even if it does not meet the lens adhesion criteria. This can enable the use of cheaper and/or more optically efficient materials at the fixture level, since the package itself meets class 4 standards.

Abstract translation: 公开了发射器​​封装，其可以包括覆盖发射极的绝缘层，例如在发射器的主发射表面和透镜或密封剂之间。 封装可以包括安装有发射极倒装芯片的子安装件，使得二极管区域位于发射极的非绝缘和/或导电基板和底座之间。 然后可以用薄的绝缘层覆盖基座。 相同或另一绝缘层可以覆盖底座上的其他电活动表面。 通过绝缘发射器的电活性表面，并且在一些实施例中，其它电活性表面，即使不符合透镜粘附标准，该封装也可满足UL8750等级4封装标准。 由于包装本身符合4级标准，因此可以在夹具水平上使用更便宜和/或更多光学有效的材料。