公开(公告)号：US12300424B2

公开(公告)日：2025-05-13

申请号：US18138148

申请日：2023-04-24

Applicant: CYNTEC CO., LTD.

Inventor： Wenyu Lin ,  TsungHao Lu ,  Hao Chun Chang

IPC: H01F27/32 ,  H01F27/02 ,  H01F27/22 ,  H01F27/24 ,  H01F27/28 ,  H01F27/29 ,  H01F41/04 ,  H05K1/18 ,  H01L25/07

Abstract: A stacked electronic structure, including a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.

公开(公告)号：US20230260693A1

公开(公告)日：2023-08-17

申请号：US18138148

申请日：2023-04-24

Applicant: CYNTEC CO., LTD.

Inventor： Wenyu Lin ,  TsungHao Lu ,  Hao Chun Chang

IPC: H01F27/32 ,  H01F27/29 ,  H01F27/28 ,  H01F27/24 ,  H01F27/02 ,  H01F27/22 ,  H05K1/18

CPC classification number: H01F27/327 ,  H01F27/29 ,  H01F27/2852 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/022 ,  H01F27/22 ,  H05K1/18 ,  H01L25/072

Abstract: A stacked electronic structure, comprising a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.

公开(公告)号：US11676758B2

公开(公告)日：2023-06-13

申请号：US16820918

申请日：2020-03-17

Applicant: CYNTEC CO., LTD.

Inventor： Wenyu Lin ,  TsungHao Lu ,  Hao Chun Chang

IPC: H01F27/22 ,  H01F27/32 ,  H01F27/29 ,  H01F27/28 ,  H01F27/24 ,  H01F27/02 ,  H05K1/18 ,  H01L25/07

CPC classification number: H01F27/327 ,  H01F27/022 ,  H01F27/22 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/2852 ,  H01F27/29 ,  H05K1/18 ,  H01L25/072 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10515

Abstract: A magnetic device comprising a magnetic body, a coil disposed in the magnetic body and at least one thermal conductive layer, wherein a first portion of the at least one thermal conductive layer encapsulates at least one portion of the coil and a second portion of the at least one thermal conductive layer is exposed from the magnetic body, wherein the at least one thermal conductive layer forms a continuous thermal conductive path from the coil to the outside of the magnetic body for dissipating heat generated from the coil.

公开(公告)号：US20200303112A1

公开(公告)日：2020-09-24

申请号：US16820918

申请日：2020-03-17

Applicant: CYNTEC CO., LTD.

Inventor： Wenyu Lin ,  TsungHao Lu ,  Hao Chun Chang

IPC: H01F27/22 ,  H01F27/02 ,  H01F27/24 ,  H05K1/18

Abstract: A magnetic device comprising a magnetic body, a coil disposed in the magnetic body and at least one thermal conductive layer, wherein a first portion of the at least one thermal conductive layer encapsulates at least one portion of the coil and a second portion of the at least one thermal conductive layer is exposed from the magnetic body, wherein the at least one thermal conductive layer forms a continuous thermal conductive path from the coil to the outside of the magnetic body for dissipating heat generated from the coil.