公开(公告)号：US20180269073A1

公开(公告)日：2018-09-20

申请号：US15972247

申请日：2018-05-07

Applicant: CYNTEC CO., LTD.

Inventor： Chia Pei Chou ,  Lang-Yi Chiang ,  Jih-Hsu Yeh ,  You Chang Tseng

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/00 ,  H01L2924/0002 ,  Y10T29/49117

Abstract: A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.

公开(公告)号：US09991136B2

公开(公告)日：2018-06-05

申请号：US15592190

申请日：2017-05-10

Applicant: CYNTEC CO., LTD.

Inventor： Chia Pei Chou ,  Lang-Yi Chiang ,  Jih-Hsu Yeh ,  You Chang Tseng

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/00 ,  H01L2924/0002 ,  Y10T29/49117

Abstract: The present invention discloses a leadframe in which two conductive pillars with a high aspect ratio and the corresponding two leads of the leadframe form a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.

公开(公告)号：US09691633B2

公开(公告)日：2017-06-27

申请号：US14337232

申请日：2014-07-22

Applicant: CYNTEC CO., LTD.

Inventor： Chia Pei Chou ,  Lang-Yi Chiang ,  Jih-Hsu Yeh ,  You Chang Tseng

IPC: H05K5/02 ,  H05K7/18 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/00 ,  H01L2924/0002 ,  Y10T29/49117

Abstract: The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.

公开(公告)号：US10256118B2

公开(公告)日：2019-04-09

申请号：US15972247

申请日：2018-05-07

Applicant: CYNTEC CO., LTD.

Inventor： Chia Pei Chou ,  Lang-Yi Chiang ,  Jih-Hsu Yeh ,  You Chang Tseng

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/498

Abstract: A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.

公开(公告)号：US20170323799A1

公开(公告)日：2017-11-09

申请号：US15592190

申请日：2017-05-10

Applicant: CYNTEC CO., LTD.

Inventor： CHIA PEI CHOU ,  LANG-YI CHIANG ,  JIH-HSU YEH ,  You Chang Tseng

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/495

CPC classification number: H01L21/486 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/00 ,  H01L2924/0002 ,  Y10T29/49117

Abstract: The present invention discloses a leadframe in which two conductive pillars with a high aspect ratio and the corresponding two leads of the leadframe form a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.

公开(公告)号：US20150027770A1

公开(公告)日：2015-01-29

申请号：US14337232

申请日：2014-07-22

Applicant: CYNTEC CO., LTD.

Inventor： CHIA PEI CHOU ,  LANG-YI CHIANG ,  JIH-HSU YEH ,  You Chang Tseng

IPC: H01L23/495 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/00 ,  H01L2924/0002 ,  Y10T29/49117

Abstract: The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.

Abstract translation: 本发明公开了一种引线框，其中具有高纵横比的两个导电柱和引线框的相应的两个引线形成用于容纳至少一个器件的3D空间。 第一引线和第二引线彼此间隔开。 第一导电柱通过在第一引线上设置第一通孔而形成在第一引线上，其中至少一个第一导电材料填充在第一通孔内部以形成第一导电柱。 第二导电柱通过在第二引线上设置第二通孔而形成在第二引线上，其中至少一个第二导电材料填充在第二通孔内部以形成第二导电柱。 第一引线，第二引线，第一导电柱和第二导电柱形成用于容纳至少一个器件的3D空间，其中至少一个器件电连接到第一导电柱和第二导电柱。