公开(公告)号：US09409276B2

公开(公告)日：2016-08-09

申请号：US14515560

申请日：2014-10-16

Applicant: Cabot Microelectronics Corporation

Inventor： Ching-Ming Tsai ,  Shi-Wei Cheng ,  Jia-Cheng Hsu ,  Kun-Shu Yang ,  Hui-Feng Chen ,  Gregory Gaudet ,  Sheng-Huan Liu

IPC: B24B37/26

CPC classification number: B24B37/26

Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves.

Abstract translation: 本发明提供一种抛光垫和使用抛光垫对基材进行化学机械研磨的方法。 抛光垫至少包括一个沟槽区域和一个排除区域，其中排除区域与抛光垫的圆周相邻，并且其中排除区域没有凹槽。