公开(公告)号：US20170087688A1

公开(公告)日：2017-03-30

申请号：US15273855

申请日：2016-09-23

Applicant: Cabot Microelectronics Corporation

Inventor： Lin FU ,  Rachel Ma ,  Nathan Speer ,  Chen-Chih Tsai ,  Kathryn Bergman

IPC: B24B37/24 ,  B24B37/04 ,  B24B37/22

Abstract: A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.