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公开(公告)号：US20210008687A1
公开(公告)日：2021-01-14
申请号：US16923688
申请日：2020-07-08
Applicant: Cabot Microelectronics Corporation
Inventor： Rui MA , Lin Fu , Chen-Chih Tsai , Jaeseck Lee , Sarah Brosnan
IPC: B24B37/24
Abstract: A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.
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