公开(公告)号：US20240264247A1

公开(公告)日：2024-08-08

申请号：US18430936

申请日：2024-02-02

Applicant: California Institute of Technology

Inventor： Saransh Sharma ,  Hayward Melton ,  Azita Emami

IPC: G01R33/028 ,  A61B5/06 ,  G01R33/02

CPC classification number: G01R33/0286 ,  A61B5/062 ,  G01R33/0206

Abstract: A three-dimensional on-chip magnetic sensor includes first, second, and third coils. The first and second coils include respective planar spirals formed by metal layers and metal vias. Each planar spiral of the first coil includes first interconnected loops wound about a first axis, where neighboring first planar spirals are electrically connected to each other. Each planar spiral of the second coil includes second interconnected loops wound about a second axis, where neighboring second planar spirals are electrically connected to each other. The third coil has a planar spiral includes third interconnected loops that are wound about a third axis. Each electrically conductive coil is configured to produce a respective electromagnetic force (EMF) induced by an oscillating magnetic field, the respective EMF driving a respective alternating current (AC) through the respective readout circuit. Each readout circuit is configured to detect a respective peak voltage magnitude of the respective AC.