摘要:
Novel monoamidine, monoamidoxime and bisamidine curatives, co-curatives and cure accelerators are provided for use with perfluoroelastomeric compositions as well as novel synthesis methods for making monoamidine- and monoamidoxime-based curatives, co-curatives and cure accelerators. Also provided are diphenyl-based curatives, co-curatives and cure accelerators having sufficiently high molecular weight such that the melting temperature of the curatives, co-curatives and cure accelerators is no greater than about 240° C., and more preferably no greater than about 230° C.
摘要:
Novel monoamidine, monoamidoxime and bisamidine curatives, co-curatives and cure accelerators are provided for use with perfluoroelastomeric compositions as well as novel synthesis methods for making monoamidine- and monoamidoxime-based curatives, co-curatives and cure accelerators. Also provided are diphenyl-based curatives, co-curatives and cure accelerators having sufficiently high molecular weight such that the melting temperature of the curatives, co-curatives and cure accelerators is no greater than about 240° C., and more preferably no greater than about 230° C.
摘要:
Novel monoamidine, monoamidoxime and bisamidine curatives, co-curatives and cure accelerators are provided for use with perfluoroelastomeric compositions as well as novel synthesis methods for making monoamidine- and monoamidoxime-based curatives, co-curatives and cure accelerators. Also provided are diphenyl-based curatives, co-curatives and cure accelerators having sufficiently high molecular weight such that the melting temperature of the curatives, co-curatives and cure accelerators is no greater than about 240° C., and more preferably no greater than about 230° C.
摘要:
Novel monoamidine, monoamidoxime and bisamidine curatives, co-curatives and cure accelerators are provided for use with perfluoroelastomeric compositions as well as novel synthesis methods for making monoamidine- and monoamidoxime-based curatives, co-curatives and cure accelerators. Also provided are diphenyl-based curatives, co-curatives and cure accelerators having sufficiently high molecular weight such that the melting temperature of the curatives, co-curatives and cure accelerators is no greater than about 240° C., and more preferably no greater than about 230° C.