公开(公告)号：US20110151202A1

公开(公告)日：2011-06-23

申请号：US12641851

申请日：2009-12-18

申请人： Casey J. FEINSTEIN ,  Kuo-Hua Sung ,  John Z. Zhong

发明人： Casey J. FEINSTEIN ,  Kuo-Hua Sung ,  John Z. Zhong

IPC分类号： B32B3/10 ,  B05D5/10 ,  B05D3/14 ,  B05D3/06 ,  B05C11/00

CPC分类号： B32B7/14 ,  B32B37/003 ,  B32B37/1292 ,  B32B2037/1253 ,  B32B2307/728 ,  B32B2307/73 ,  B32B2310/025 ,  B32B2310/0806 ,  B32B2310/12 ,  B32B2457/00 ,  Y10T428/24802

摘要： Controllable placement of a liquid adhesive on a substrate to confine the adhesive to a desired area of the substrate is disclosed. A controllable placement method can include dispensing a liquid adhesive into a designated area on a surface of a substrate, controllably confining the dispensed liquid adhesive to the designated area, and curing the confined liquid adhesive. The dispensed liquid adhesive can be controllably confined using various techniques, such as electrical repulsion, electrical attraction, capacitance, electrowetting, light curing, adhesive attracting-repulsing coatings, and substrate topography. A substrate having a controllably placed liquid adhesive thereon can be incorporated into electronic devices, such as a mobile telephone, a digital media player, or a personal computer.

摘要翻译： 公开了将液体粘合剂可控地放置在基底上以将粘合剂限制在基底的期望区域上。 可控放置方法可以包括将液体粘合剂分配到基底表面上的指定区域中，可控制地将分配的液体粘合剂限制在指定区域上，并固化限制的液体粘合剂。 分配的液体粘合剂可以使用各种技术，例如电排斥，电吸引，电容，电润湿，光固化，粘合剂吸引 - 斥斥涂层和基底形貌来控制地限制。 在其上具有可控地放置液体粘合剂的基板可以结合到诸如移动电话，数字媒体播放器或个人计算机的电子设备中。

公开(公告)号：US20120009703A1

公开(公告)日：2012-01-12

申请号：US13234072

申请日：2011-09-15

申请人： Casey J. FEINSTEIN ,  John Z. Zhong ,  Lynn R. Youngs ,  Stephen S. Poon

发明人： Casey J. FEINSTEIN ,  John Z. Zhong ,  Lynn R. Youngs ,  Stephen S. Poon

IPC分类号： H01L33/08

CPC分类号： G06F3/0416 ,  G02F1/1333 ,  G02F1/1368 ,  G06F3/044 ,  H01L27/1266 ,  Y10T29/49155

摘要： A method of fabricating a display panel from a thin substrate using a carrier substrate is disclosed. The method includes depositing a bonding agent on a first surface of the thin substrate; depositing a bonding agent on a second surface of the carrier substrate; bonding the thin substrate and the carrier substrate with the bonding agent deposited on the first surface and the second surface; performing thin film processing on a third surface of the thin substrate opposite the first surface; and separating the processed thin substrate from the carrier substrate. The thin substrate has a thickness less than a required thickness for sustaining thin film processing while a thickness of the bonded thin substrate and the carrier substrates is greater than or equal to that the required thickness.

摘要翻译： 公开了一种使用载体衬底从薄衬底制造显示面板的方法。 该方法包括在薄衬底的第一表面上沉积粘合剂; 在所述载体基板的第二表面上沉积粘合剂; 用沉积在第一表面和第二表面上的粘结剂粘合薄基片和载体基片; 在与第一表面相对的薄基板的第三表面上执行薄膜处理; 并且将经处理的薄衬底与载体衬底分离。 薄基板的厚度小于用于维持薄膜处理所需的厚度，而粘合的薄基板和载体基板的厚度大于或等于所需的厚度。