Heat Management and Removal Assemblies for Semiconductor Devices
    2.
    发明申请
    Heat Management and Removal Assemblies for Semiconductor Devices 有权
    半导体器件热管理和拆卸组件

    公开(公告)号:US20160234967A1

    公开(公告)日:2016-08-11

    申请号:US14616083

    申请日:2015-02-06

    CPC classification number: H05K7/20927 H01L23/473 H05K7/20254 H05K7/20918

    Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

    Abstract translation: 该专利公开描述了在使用期间产生热的电子设备的热管理和去除组件。 所公开的组件对于冷却绝缘栅双极晶体管(IGBT)特别有用。 所公开的组件提供用于有效地将冷却剂输送到一个或多个电子设备的低电阻并行冷却电路。 公开的平行冷却回路和组装设计降低了将冷却剂输送到一个或多个电子设备所需的泵功率。

Patent Agency Ranking