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    Heat Management and Removal Assemblies for Semiconductor Devices
    1.
    发明申请
    Heat Management and Removal Assemblies for Semiconductor Devices 有权
    半导体器件热管理和拆卸组件

    公开(公告)号：US20160234967A1

    公开(公告)日：2016-08-11

    申请号：US14616083

    申请日：2015-02-06

    Applicant: Caterpillar Inc.

    Inventor： Edward Choi ,  Chris J. Scolton ,  Jacob Wyss

    IPC: H05K7/20

    CPC classification number: H05K7/20927 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/20918

    Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

    Abstract translation: 该专利公开描述了在使用期间产生热的电子设备的热管理和去除组件。 所公开的组件对于冷却绝缘栅双极晶体管（IGBT）特别有用。 所公开的组件提供用于有效地将冷却剂输送到一个或多个电子设备的低电阻并行冷却电路。 公开的平行冷却回路和组装设计降低了将冷却剂输送到一个或多个电子设备所需的泵功率。

    Cooling Module for Electrical Components
    2.
    发明申请
    Cooling Module for Electrical Components 审中-公开
    电气元件冷却模块

    公开(公告)号：US20160021784A1

    公开(公告)日：2016-01-21

    申请号：US14331752

    申请日：2014-07-15

    Applicant: CATERPILLAR INC.

    Inventor： Edward Choi ,  Chris J. Scolton

    IPC: H05K7/20

    CPC classification number: H05K7/20927 ,  H05K7/20254

    Abstract: A cooling module for an electrical component is provided. The cooling module includes a housing defining an interior space for receiving a coolant. A flow directing member is arranged in the interior space of the housing. The flow directing member includes a plate that is divided into a plurality of discrete cells arranged parallel to each other with adjacent cells being separated from each other by a dividing wall. Each cell has an inlet opening in the plate through which coolant is directed onto a surface of the plate and an outlet opening in the plate through which coolant is directed off the surface of the plate. Each cell has a plurality of fins arranged on the surface of the plate in a herringbone pattern.

    Abstract translation: 提供了用于电气部件的冷却模块。 冷却模块包括限定用于接收冷却剂的内部空间的壳体。 流动引导构件布置在壳体的内部空间中。 流动引导构件包括板，其被分成彼此平行布置的多个离散单元，相邻单元通过分隔壁彼此分离。 每个电池在板中具有入口开口，冷却剂通过该入口导向板的表面和板中的出口开口，冷却剂通过该开口被引导离开板的表面。 每个单元具有以人字形图案布置在板的表面上的多个翅片。

    Integrated Fluid Turbulator and Sealing System for Improved Thermal Management
    3.
    发明申请
    Integrated Fluid Turbulator and Sealing System for Improved Thermal Management 审中-公开

    公开(公告)号：US20170164516A1

    公开(公告)日：2017-06-08

    申请号：US14957198

    申请日：2015-12-02

    Applicant: Caterpillar Inc.

    Inventor： Chris J. Scolton ,  Edward Choi ,  Jacob C. Wyss

    IPC: H05K7/20 ,  F28F13/12 ,  F28F11/00

    CPC classification number: H01L23/473 ,  H01M10/6556 ,  H05K7/20254 ,  H05K7/20927

    Abstract: A cooling device for an electric component may include a manifold with a coolant section having a coolant inlet trough and a coolant outlet trough. The device may further include a fluid turbulator having a turbulator plate with turbulator fins extending upwardly therefrom, and turbulator inlet openings and outlet openings through the turbulator plate, and a turbulator carrier surrounding the turbulator plate. The fluid turbulator may be installed between the coolant section and the electric component so that a heat exchange reservoir is defined by bottom surface of the electric component, the turbulator plate top surface and the turbulator carrier. Coolant from a coolant source may flow into the coolant inlet trough, through the turbulator inlet opening into the heat exchange reservoir, and out of the heat exchange reservoir through the turbulator outlet opening into the coolant outlet trough to remove heat from the electric component.

    GAS FLOW SYSTEM FOR A MACHINE
    7.
    发明申请
    GAS FLOW SYSTEM FOR A MACHINE 审中-公开
    用于机器的气体流动系统

    公开(公告)号：US20140373947A1

    公开(公告)日：2014-12-25

    申请号：US14189137

    申请日：2014-02-25

    Applicant: Caterpillar Inc.

    Inventor： Haiping Hong ,  Chris J. Scolton ,  Tyler J. Williams

    IPC: F17D5/00

    CPC classification number: F17D5/00 ,  B60K13/02 ,  B60K13/04 ,  B60Y2200/415 ,  E02F3/36 ,  E02F9/0866 ,  Y10T137/794

    Abstract: A gas flow system for a machine. The gas flow system can include an air filtration system which can include a debris chamber. The gas flow system can also include a first conduit, a second conduit, and one or more tabs. The first conduit can extend from an upstream end to a downstream end. The upstream end of the first conduit can be connected in fluid communication with the debris chamber, and the downstream end of the first conduit can be positioned within the second conduit. The one or more tabs can be positioned within the second conduit adjacent to the downstream end of the first conduit. The second conduit can include one or more of a decreasing diameter and a substantially consistent diameter adjacent to and downstream of the downstream end of the first conduit.

    Abstract translation: 用于机器的气体流动系统。 气体流动系统可以包括可以包括碎片室的空气过滤系统。 气体流动系统还可以包括第一导管，第二导管和一个或多个突片。 第一导管可以从上游端延伸到下游端。 第一导管的上游端可以与碎片室流体连通地连接，并且第一导管的下游端可以定位在第二导管内。 一个或多个突片可以定位在邻近第一导管的下游端的第二导管内。 第二导管可以包括在第一导管的下游端附近和下游的直径减小和基本一致的直径中的一个或多个。

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