公开(公告)号：US20230164916A1

公开(公告)日：2023-05-25

申请号：US17834874

申请日：2022-06-07

申请人： Celestica Technology Consultancy (Shanghai) Co. Ltd

发明人： Jing LI ,  Haiju HUANG ,  Chenxia FENG ,  Chunmei WU

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC分类号： H05K1/115 ,  H05K1/18 ,  H05K1/0298 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2203/02

摘要： The present disclosure provides a printed circuit board and a wire arrangement method thereof. The printed circuit board includes a packaged chip and at least two connectors, wires of the packaged chip that are connected to different connectors are distributed on different board layers; and when the packaged chip is connected to one of the connectors, a via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out. The wires of the packaged chip that are connected to different connectors are distributed on different board layers. When the packaged chip is connected to one of the connectors, according to backdrilling of different depths, the via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out.