摘要:
A flooring system for use in thermal and/or acoustic floor systems is provided where the flooring system mitigates external forces from a shock/blast wave. The flooring system includes a foam layer and filler material that includes micro and/or nano structures strategically dispersed in the foam layer. The micro and/or nano structures mitigate a magnitude of the external forces propagating through the foam layer.
摘要:
A flooring system for use in thermal and/or acoustic floor systems is provided where the flooring system mitigates external forces from a shock/blast wave. The flooring system includes a foam layer and filler material that includes micro and/or nano structures strategically dispersed in the foam layer. The micro and/or nano structures mitigate a magnitude of the external forces propagating through the foam layer.
摘要:
The present invention is an article of manufacture comprised of advanced composites having structural, electrical, and thermal characteristics. More specifically, it is an interconnection system that comprises at least one advanced composite material with controlled mechanical, electrical, and thermal properties. When employed in specific configurations and combinations, the subject invention is particularly suited for advanced armaments systems
摘要:
A hydrophobic insulating foam for use in, for example, insulating the walls of an aircraft fuselage, includes a base foam and a water repellant coating. The base foam has a plurality of interconnected open cells. The interconnected open cells and the outside of the base foam define a surface area. The water repellant coating is deposited on the surface area. The hydrophobic open celled foam may be made by providing a base foam having a plurality of interconnected open cells, providing a water repellant coating, and depositing the water repellant coating upon the surface area of the provided base foam.
摘要:
Provided herein is an apparatus having management of electrical power capacity regions and management of thermal capacity regions including a substrate member region having a length, a width, a thickness, and a surface area. The substrate member region may include a host binder material consisting of a polymer, a thermal plastic polymer, a thermo setting polymer, an intrinsically conductive polymer, an elastomer, a ceramic, a glass, a cement, a metal, a synthetic metal, combinations and mixtures of the above and the like, at least one conductive region for management of electrical power capacity and at least one conductive region for management of thermal capacity and at least one non-conductive regions. At least one of the regions for management of electrical power capacity and, optionally, at least one of the regions for management of thermal capacity as well as non-conductive regions may include an exposed surface for contact with another surface of a functional device.