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公开(公告)号：US12113402B2
公开(公告)日：2024-10-08
申请号：US17392650
申请日：2021-08-03
Applicant: BLACK & DECKER INC.
Inventor： Eric W. Wachter , Erik A. Ekstrom , Alpay Hizal
CPC classification number: H02K11/30 , H05K1/0213 , H05K7/1427 , H05K2201/10053 , H05K2201/1009 , H05K2201/10151
Abstract: An electronic switch module includes a circuit board having conductive pads coupled to a power source and a sense pad coupled to an output signal; and a variable-speed actuator assembly having an actuator positioned adjacent a side edge of the circuit board and moveable along a movement axis, a plunger coupled to the actuator, and a conductive wiper secured to the plunger in contact with the circuit board. The wiper includes a first leg arranged to slidably engage the sense pad and a second leg arranged to slidably engage at least one of the conductive pads. The sense pad is longitudinally aligned with the conductive pads. The first leg of the wiper is located between the actuator and the second leg, and the sense pad is located between the side edge of the circuit board and the conductive pads.
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公开(公告)号：US20240276633A1
公开(公告)日：2024-08-15
申请号：US18648649
申请日：2024-04-29
Applicant: AVL Software and Functions GmbH
Inventor： Christoph BAUER , Peter WEISS
CPC classification number: H05K1/0213 , H05K1/181
Abstract: A power module having reduced intrinsic inductance has an at least partially electrically insulating layer that has a first surface on which a power electronics unit is arranged and a second surface which is opposite the first surface. The module also has a compensation layer arranged on the second surface, which the compensation layer is electrically conductive and which the compensation layer is electrically connected to the electric potential of the power electronics unit.
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公开(公告)号：US12052822B2
公开(公告)日：2024-07-30
申请号：US17375307
申请日：2021-07-14
Applicant: Samsung Electronics Co., Ltd. , SNU R&DB Foundation
Inventor： Seung Wook Lee , Jangwoo Kim , Pyeongsu Park
CPC classification number: H05K1/14 , G06F9/5027 , G06F9/54 , H05K1/0213 , H05K2201/047
Abstract: An electronic device includes: a host box comprising a host processor configured to control an operation of the electronic device, a host motherboard in which the host processor is disposed, and a host power supply unit (PSU) configured to supply power to a component connected to the host motherboard; and one or more extension boxes controlled by the host box, wherein each of the one or more extension boxes comprises an extension motherboard independent of the host box, and an extension PSU independent of the host box and configured to supply power to a component connected to the extension motherboard.
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公开(公告)号：US12009613B2
公开(公告)日：2024-06-11
申请号：US18132094
申请日：2023-04-07
Applicant: FCI USA LLC
Inventor： Rongzhe Guo , Clarence Randall Fry , Chao Zou
CPC classification number: H01R13/2492 , H01R12/7088 , H01R12/721 , H01R13/26 , H05K1/0213 , H05K1/117 , H05K5/0026 , H01R12/724 , H01R12/727
Abstract: A power terminal includes first and second conductive sheets. The first conductive sheet includes a first joining portion, first fingers extending from the first joining portion, and a first mounting portion extending from the first joining portion and configured to mount to a substrate. The first fingers have hooked ends connected to the first joining portion by first beams. The second conductive sheet includes a second joining portion, second fingers extending from the second joining portion, and a second mounting portion extending from the second joining portion and configured to mount to the substrate. The two second fingers have curved ends connected to the second joining portion by second beams. The hooked ends and the curved ends include contact surfaces configured to contact a same side of a card. At least one of the first and second mounting portions includes at least two mounting tails.
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公开(公告)号：US20240130068A1
公开(公告)日：2024-04-18
申请号：US18399565
申请日：2023-12-28
Applicant: Intel Corporation
Inventor： Nan Wang , Zhichao Z. Zhang , Lihui Wu , Jialiang Xu , Xiaoguo Liang , Bo Chen , Haifeng Gong
CPC classification number: H05K7/1492 , H01R12/79 , H05K1/0213 , H05K7/1402 , H05K2201/0154 , H05K2201/10386
Abstract: Technologies for a flexible three-dimensional power plane in a chassis are disclosed. In one embodiment, a flexible ribbon cable is laid along a circuit board tray. The flexible ribbon cable is secured to the tray using power bosses. The power bosses connect to one or more conductors on the ribbon cable. When the circuit board is mounted on the circuit board tray, the power bosses extend through holes in the circuit board and mate with power clips on the surface of the circuit board tray. The ribbon cable, power bosses, and power clips can distribute power to various locations on the circuit board, without requiring large traces that take up space on the circuit board.
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Patent Agency Ranking
公开(公告)号：US20240127991A1
公开(公告)日：2024-04-18
申请号：US18487155
申请日：2023-10-16
Applicant: RAYCAP, S.A.
Inventor： Georgios Peppas , Alexis Chorozoglou , Elias Fermelis , Zafiris G. Politis
CPC classification number: H01C7/12 , H01C1/02 , H05K1/0213 , H05K1/0218 , H05K1/18 , H05K2201/10022
Abstract: A surge protective device (SPD) module includes a printed circuit board (PCB), a first electrode, a second electrode, and a varistor electrically connected between the first and second electrodes. The SPD module forms a housing assembly defining a chamber containing the varistor. The PCB forms a portion of the housing assembly.
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公开(公告)号：US11895769B2
公开(公告)日：2024-02-06
申请号：US17480429
申请日：2021-09-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuya Okamoto , Takashi Haga , Masayoshi Takagi , Kazushige Sato
CPC classification number: H05K1/0213 , H01R12/52 , H01R13/5219 , H05K2203/1147
Abstract: A module according to the present disclosure includes a circuit board, an electronic component on one of two principal surfaces of the circuit board, a connection conductor on the principal surface of the circuit board, and sealing resin on the principal surface of the circuit board. The electronic component and the connection conductor are covered with the sealing resin. The connection conductor includes a plate-shaped conductor and terminal sections. The plate-shaped conductor is disposed upright on the principal surface of the circuit board. The terminal sections extend from the plate-shaped conductor and away from the principal surface of the circuit board and are arranged side by side. Tip portions of the terminal sections are exposed at a surface of the sealing resin.
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公开(公告)号：US20240003940A1
公开(公告)日：2024-01-04
申请号：US18467942
申请日：2023-09-15
Applicant: Melexis Technologies SA
Inventor： Lucian BARBUT , Simon HOUIS , Lionel TOMBEZ , Tim VANGERVEN
CPC classification number: G01R15/202 , G01R15/205 , H05K2201/10151 , H05K1/181 , H05K1/0213
Abstract: A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.
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公开(公告)号：US20230354529A1
公开(公告)日：2023-11-02
申请号：US18124431
申请日：2023-03-21
Inventor： Marco Gavagnin
CPC classification number: H05K3/4644 , H05K1/0213 , H05K2201/026 , H05K2201/0379
Abstract: Described herein is a component carrier, wherein the component carrier comprises a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, wherein a first of said electrically conductive layer structures comprises a first surface where a first plurality of conductive nanowires is connected and a second of said electrically conductive layer structures comprises a second surface where a second plurality of conductive nanowires is connected, wherein said first and second surfaces and said first and second pluralities of nanowires are configured to at least partially connect the nanowires of the first plurality of nanowires with the respective nanowires of the second plurality of nanowires.
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公开(公告)号：US20230335952A1
公开(公告)日：2023-10-19
申请号：US17723467
申请日：2022-04-19
Applicant: DELL PRODUCTS L.P.
Inventor： Sandor Farkas , Mark Smith , Bhyrav Mutnury
IPC: H01R13/6474 , H05K1/02 , H05K3/32 , H01R13/6581 , H01R43/20
CPC classification number: H01R13/6474 , H05K1/0213 , H05K3/32 , H01R13/6581 , H01R43/205 , H05K2201/10189 , H01R12/58
Abstract: A connector includes a connector core and ant outer shell. The connector core includes a plurality of contacts for coupling a device to a PCB, The connector core exhibits a first impedance for signals provided on the contacts. The outer shell is configured to be rigidly attached to the connector core. When the outer shell has a first configuration and is attached to the connector core, the connector exhibits a second impedance for signals provided on the contacts, the second impedance being different from the first impedance. When the outer shell has a second configuration and is attached to the connector core, the connector exhibits a third impedance for signals provided on the contacts, the third impedance being different from the first and second impedances.
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