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    Chip-type electric double layer capacitor cell and method of manufacturing the same
    1.
    发明申请
    Chip-type electric double layer capacitor cell and method of manufacturing the same 审中-公开
    片式双电层电容器及其制造方法

    公开(公告)号：US20110102972A1

    公开(公告)日：2011-05-05

    申请号：US12923950

    申请日：2010-10-15

    申请人： Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Hyun Chul Jung ,  Yeong Su Cho ,  Sang Kyun Lee

    发明人： Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Hyun Chul Jung ,  Yeong Su Cho ,  Sang Kyun Lee

    IPC分类号： H01G9/08 ,  H01G13/00 ,  B23K11/00 ,  B23K20/10

    CPC分类号： H01G11/80 ,  H01G9/016 ,  H01G9/10 ,  H01G9/155 ,  H01G11/74 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13 ,  Y02T10/7022

    摘要： There is provided a chip-type electric double layer capacitor comprising: a resin case having a housing space provided therein and formed of insulating resin and first and second external terminals inserted into the resin case by insert injection molding. Each of the external terminals has a first portion exposed to an outer surface of the resin case for external contact and a second portion exposed to an inner surface of the housing space for internal contact. a sealing portion includes a groove portion provided in the resin case along a circumference of at least one of the first and second external terminals and a resin filling the groove portion. An electric double layer capacitor cell is mounted in the housing space and electrically connected to the second portion of the first and second external terminals.

    摘要翻译： 提供了一种芯片式双电层电容器，包括：具有设置在其中的由绝缘树脂形成的容纳空间的树脂壳体和通过插入注射成型插入到树脂壳体中的第一和第二外部端子。 每个外部端子具有暴露于用于外部接触的树脂壳体的外表面的第一部分和暴露于壳体空间的内表面以用于内部接触的第二部分。 密封部分包括沿着第一和第二外部端子中的至少一个的圆周设置在树脂壳体中的凹槽部分和填充凹槽部分的树脂。 电双层电容器电池安装在容纳空间中并电连接到第一和第二外部端子的第二部分。

    Chip-type electric double layer capacitor and method for manufacturing the same
    2.
    发明申请
    Chip-type electric double layer capacitor and method for manufacturing the same 审中-公开
    片式双电层电容器及其制造方法

    公开(公告)号：US20110058307A1

    公开(公告)日：2011-03-10

    申请号：US12591410

    申请日：2009-11-18

    申请人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

    发明人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

    IPC分类号： H01G9/155

    CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/52 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13

    摘要： The present invention relates to a chip-type electric double layer capacitor and a method for manufacturing a method for manufacturing the same. The chip-type electric double layer capacitor includes an electric double layer element including two electrodes that include two different polarities and electrode terminals protruded on sides opposite to each other, a first separator that prevents the two electrodes from being short-circuited, and a second separator that is disposed at a position opposed to the first separator on the basis of one electrode of the two electrodes; and a package including package terminals attached to the protruded electrode terminals of the two electrodes, which are formed on the bottom thereof and housing the electric double layer element, wherein the electric double layer element is wound on the basis of the protruded electrode terminals opposite to the two electrodes as a reference axis and the electrode terminals are attached to the package terminals, respectively.

    摘要翻译： 芯片型双电层电容器及其制造方法技术领域本发明涉及芯片式双电层电容器及其制造方法。 芯片式双电层电容器包括双电层元件，其包括两个电极，其包括两个不同的极性，并且在彼此相反的一侧突出的电极端子，防止两个电极短路的第一隔板，以及第二隔离件 分离器，其基于两个电极的一个电极设置在与第一分离器相对的位置处; 以及包括安装在两个电极的突出电极端子上的封装端子的封装，它们形成在其底部并容纳双电层元件，其中基于与第二电极相对的突出电极端子缠绕双电层元件 作为参考轴的两个电极和电极端子分别附接到封装端子。

    METHOD OF MANUFACTURING CHIP-TYPE ELECTRIC DOUBLE LAYER CAPACITOR
    4.
    发明申请
    METHOD OF MANUFACTURING CHIP-TYPE ELECTRIC DOUBLE LAYER CAPACITOR 审中-公开
    芯片型双电层电容器的制造方法

    公开(公告)号：US20120297594A1

    公开(公告)日：2012-11-29

    申请号：US13568483

    申请日：2012-08-07

    申请人： Sang Kyun Lee ,  Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Hyun Chul Jung

    发明人： Sang Kyun Lee ,  Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Hyun Chul Jung

    IPC分类号： H01G9/155

    CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13 ,  Y02T10/7022 ,  Y10T29/417

    摘要： A method of manufacturing a chip-type electric double layer capacitor, including: forming a lower case having an opened housing space and first and second external terminals buried therein, the first and second external terminals having first surfaces exposed to the housing space, respectively, and second surfaces exposed to an outer region of the lower case, respectively; mounting an electric double layer capacitor cell in the housing space such that the electric double layer capacitor cell is electrically connected to the first surfaces of the first and second external terminals exposed to the housing space; and mounting an upper cap on the lower case so as to cover the housing space.

    摘要翻译： 一种制造芯片式双电层电容器的方法，包括：形成具有开放的容纳空间的下壳体和埋入其中的第一和第二外部端子，第一和第二外部端子分别具有暴露于容纳空间的第一表面， 以及分别暴露于所述下壳体的外部区域的第二表面; 将双电层电容器单元安装在容纳空间中，使得双电层电容器单元电连接到暴露于容纳空间的第一和第二外部端子的第一表面; 并将上盖安装在下壳体上以覆盖住容纳空间。

    Chip-type electric double layer capacitor and method of manufacturing the same
    6.
    发明申请
    Chip-type electric double layer capacitor and method of manufacturing the same 审中-公开
    片式双电层电容器及其制造方法

    公开(公告)号：US20110002084A1

    公开(公告)日：2011-01-06

    申请号：US12654751

    申请日：2009-12-30

    申请人： Sang Kyun Lee ,  Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Hyun Chul Jung

    发明人： Sang Kyun Lee ,  Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Hyun Chul Jung

    IPC分类号： H01G9/08

    CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13 ,  Y02T10/7022

    摘要： A chip-type electric double layer capacitor includes: an exterior case including a housing space formed therein and formed of insulation resin; a first external terminal buried in the exterior case and including a first surface exposed to the housing space and a second surface exposed to the outside of the exterior case; a second external terminal buried in the exterior case and including a first surface exposed to the housing space and a second surface exposed to the outside of the exterior case; and an electric double layer cell disposed in the housing space so as to be electrically connected to the first surfaces of the first and second external terminals.

    摘要翻译： 芯片型双电层电容器包括：外壳，包括形成在其中并由绝缘树脂形成的容纳空间; 第一外部端子，其被埋在所述外部壳体中并且包括暴露于所述壳体空间的第一表面和暴露于所述外部壳体的外部的第二表面; 第二外部端子，其被埋在所述外部壳体中，并且包括暴露于所述容纳空间的第一表面和暴露于所述外部壳体的外部的第二表面; 以及设置在所述容纳空间中以与所述第一和第二外部端子的第一表面电连接的双电层单元。

    Methods of manufacturing electric double layer capacitor cell and electric double layer capacitor and apparatus for manufacturing electric double layer capacitor cell
    8.
    发明申请
    Methods of manufacturing electric double layer capacitor cell and electric double layer capacitor and apparatus for manufacturing electric double layer capacitor cell 失效
    制造双电层电容器电池和双电层电容器的方法及制造双电层电容器电池的方法

    公开(公告)号：US20110197408A1

    公开(公告)日：2011-08-18

    申请号：US12923829

    申请日：2010-10-08

    申请人： Sang Kyun Lee ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Chang Ryul Jung ,  Wan Suk Yang

    发明人： Sang Kyun Lee ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Chang Ryul Jung ,  Wan Suk Yang

    IPC分类号： H01G9/00

    CPC分类号： H01G9/0029 ,  Y02E60/13 ,  Y10T29/413 ,  Y10T29/417 ,  Y10T29/49114 ,  Y10T29/4913

    摘要： There are provided methods of manufacturing an electric double layer capacitor cell and an electric double layer capacitor and an apparatus for manufacturing an electric double layer capacitor cell. The method of manufacturing the electric double layer capacitor cell includes preparing first and second electrode sheets by printing electrode material onto conductive sheets, respectively, with the exception of regions to be provided as first and second terminal lead-out portions in the conductive sheets; punching the first and second electrode sheets so as to form a plurality of first and second unit electrodes, respectively, each first unit electrode having the first terminal lead-out portion and each second unit electrode having the second terminal lead-out portion; stacking the first and second electrode sheets with a separator interposed therebetween in order that the plurality of first and second unit electrodes are overlapped; and cutting the first and second electrode sheets being stacked into the first and second unit electrodes.

    摘要翻译： 提供制造双电层电容器单元和双电层电容器的方法以及双电层电容器单元的制造装置。 制造双电层电容器单元的方法包括通过将电极材料分别印刷到导电片上来制备第一和第二电极片，除了要在导电片中作为第一和第二端子引出部分设置的区域之外; 冲压第一和第二电极片以分别形成多个第一和第二单位电极，每个第一单元电极具有第一端子引出部分和每个第二单位电极具有第二端子引出部分; 为了使多个第一和第二单位电极重叠，将第一和第二电极片层叠在隔板之间; 以及切割堆叠在第一和第二单元电极中的第一和第二电极片。

    Methods of manufacturing electric double layer capacitor cell and electric double layer capacitor and apparatus for manufacturing electric double layer capacitor cell
    10.
    发明授权
    Methods of manufacturing electric double layer capacitor cell and electric double layer capacitor and apparatus for manufacturing electric double layer capacitor cell 失效
    制造双电层电容器电池和双电层电容器的方法及制造双电层电容器电池的方法

    公开(公告)号：US08187343B2

    公开(公告)日：2012-05-29

    申请号：US12923829

    申请日：2010-10-08

    申请人： Sang Kyun Lee ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Chang Ryul Jung ,  Wan Suk Yang

    发明人： Sang Kyun Lee ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Chang Ryul Jung ,  Wan Suk Yang

    IPC分类号： H01M4/82

    CPC分类号： H01G9/0029 ,  Y02E60/13 ,  Y10T29/413 ,  Y10T29/417 ,  Y10T29/49114 ,  Y10T29/4913

    摘要： There are provided methods of manufacturing an electric double layer capacitor cell and an electric double layer capacitor and an apparatus for manufacturing an electric double layer capacitor cell. The method of manufacturing the electric double layer capacitor cell includes preparing first and second electrode sheets by printing electrode material onto conductive sheets, respectively, with the exception of regions to be provided as first and second terminal lead-out portions in the conductive sheets; punching the first and second electrode sheets so as to form a plurality of first and second unit electrodes, respectively, each first unit electrode having the first terminal lead-out portion and each second unit electrode having the second terminal lead-out portion; stacking the first and second electrode sheets with a separator interposed therebetween in order that the plurality of first and second unit electrodes are overlapped; and cutting the first and second electrode sheets being stacked into the first and second unit electrodes.

    摘要翻译： 提供制造双电层电容器单元和双电层电容器的方法以及双电层电容器单元的制造装置。 制造双电层电容器单元的方法包括通过将电极材料分别印刷到导电片上来制备第一和第二电极片，除了要在导电片中作为第一和第二端子引出部分设置的区域之外; 冲压第一和第二电极片以分别形成多个第一和第二单位电极，每个第一单元电极具有第一端子引出部分和每个第二单位电极具有第二端子引出部分; 为了使多个第一和第二单位电极重叠，将第一和第二电极片层叠在隔板之间; 以及切割堆叠在第一和第二单元电极中的第一和第二电极片。