公开(公告)号：US11904400B2

公开(公告)日：2024-02-20

申请号：US17733109

申请日：2022-04-29

Applicant: Changsha University of Science and Technology

Inventor： Cong Mao ,  Weidong Tang ,  Yuanqiang Luo ,  Yinghui Ren ,  Wei Li ,  Mingjun Zhang ,  Kun Tang ,  Gang Wu ,  Yongle Hu ,  Feng Shi ,  Ziyang Chen ,  Zhuo Wen

IPC: B23H5/04 ,  B23H9/02 ,  B23H3/02 ,  B23H3/08

CPC classification number: B23H9/02 ,  B23H3/02 ,  B23H3/08 ,  B23H5/04 ,  B23H2300/10

Abstract: This paper describes an invention involving an electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials. The specific machining method is described below. A micro-grinding tool and an auxiliary electrode are respectively connected to the negative and positive electrodes of a pulsed DC power supply. When the current flows through the loop, an electrochemical hydrogen evolution reaction (HER) occurs at the micro-grinding tool in the grinding fluid, which generate multiple hydrogen bubbles. The bubbles coalesce into an insulating gas film and separate the micro-grinding tool from the grinding fluid; when the critical voltage is reached, the gas film is broken down and an electrochemical discharge occurs accompanied by discharge spark; under the action of the discharge spark, the surface material of the workpiece in the discharge-affected region is directly ablated to generate a heat-affected layer (HAL), namely, physical modification.

公开(公告)号：US11992890B2

公开(公告)日：2024-05-28

申请号：US17733117

申请日：2022-04-29

Applicant: Changsha University of Science and Technology

Inventor： Cong Mao ,  Ziyang Chen ,  Yinghui Ren ,  Wei Li ,  Yuanqiang Luo ,  Gang Wu ,  Mingjun Zhang ,  Kun Tang ,  Yongle Hu ,  Feng Shi ,  Weidong Tang ,  Ci Song

IPC: B23H5/06 ,  B23H5/10 ,  B23H5/12 ,  B23H9/00 ,  B24B7/22 ,  B24B7/24

CPC classification number: B23H5/06 ,  B23H5/10 ,  B23H5/12 ,  B23H9/008 ,  B24B7/228 ,  B24B7/24

Abstract: The invention provides an electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials. The device includes a micro-grinding tool, grinding fluid, a workpiece, an auxiliary electrode, a processing groove, and a pulsed DC power supply; the processing groove is filled with grinding fluid; the micro-grinding tool, the workpiece, and the auxiliary electrode are immersed in the grinding fluid; the micro-grinding tool is composed of a conductive grinding tool base, an electroplating layer, and insulated superabrasives. The micro-grinding tool is connected to the negative electrode of the pulsed DC power supply; the grinding fluid is composed of H2O2, Na2CO3, EDTA-Fe-Na, and deionized water; the workpiece material is brittle and hard; a large number of micro structures need to be produced on the surface of the workpiece.