ACTIVE COMPENSATING HYDROSTATIC BEARING AND HYDROSTATIC BEARING MODULE USING THE SAME
    1.
    发明申请
    ACTIVE COMPENSATING HYDROSTATIC BEARING AND HYDROSTATIC BEARING MODULE USING THE SAME 有权
    主动补偿静水压轴承和使用其的静液压轴承模块

    公开(公告)号:US20130016927A1

    公开(公告)日:2013-01-17

    申请号:US13357148

    申请日:2012-01-24

    IPC分类号: F16C32/06 F16C33/72

    摘要: An active/self-sensing compensating hydrostatic bearing is disposed between first and second structures to allow relative movement between the first and second structures. The hydrostatic bearing includes a body and a compensator. The body, fixed to the first structure and separated from the second structure by a first gap, has a chamber and an input passage and an output passage both communicating with the chamber. The compensator is disposed in the chamber. A compensating passage, communicating with the input passage and the output passage, is formed between the body and the compensator. A pressurized fluid flows from the input passage to the output passage through the compensating passage, and the pressurized fluid in the output passage flows to the first gap to maintain the stability and the rigidity for the relative movement between the first and second structures. A hydrostatic bearing module using the hydrostatic bearing is also disclosed.

    摘要翻译: 主动/自感补偿静压轴承设置在第一和第二结构之间以允许第一和第二结构之间的相对运动。 静压轴承包括主体和补偿器。 固定到第一结构体并且与第二结构分离的主体具有第一间隙,具有腔室和输入通道以及与腔室连通的输出通道。 补偿器设置在腔室中。 在主体和补偿器之间形成有与输入通道和输出通道连通的补偿通道。 加压流体从输入通道流经通过补偿通道的输出通道,并且输出通道中的加压流体流到第一间隙,以保持第一和第二结构之间的相对运动的稳定性和刚性。 还公开了一种使用静压轴承的静压轴承组件。

    Active compensating hydrostatic bearing and hydrostatic bearing module using the same
    2.
    发明授权
    Active compensating hydrostatic bearing and hydrostatic bearing module using the same 有权
    主动补偿静压轴承和静压轴承模块使用相同

    公开(公告)号:US08556509B2

    公开(公告)日:2013-10-15

    申请号:US13357148

    申请日:2012-01-24

    IPC分类号: F16C32/06

    摘要: An active/self-sensing compensating hydrostatic bearing is disposed between first and second structures to allow relative movement between the first and second structures. The hydrostatic bearing includes a body and a compensator. The body, fixed to the first structure and separated from the second structure by a first gap, has a chamber and an input passage and an output passage both communicating with the chamber. The compensator is disposed in the chamber. A compensating passage, communicating with the input passage and the output passage, is formed between the body and the compensator. A pressurized fluid flows from the input passage to the output passage through the compensating passage, and the pressurized fluid in the output passage flows to the first gap to maintain the stability and the rigidity for the relative movement between the first and second structures. A hydrostatic bearing module using the hydrostatic bearing is also disclosed.

    摘要翻译: 主动/自感补偿静压轴承设置在第一和第二结构之间以允许第一和第二结构之间的相对运动。 静压轴承包括主体和补偿器。 固定到第一结构体并且与第二结构分开的主体具有第一间隙,具有腔室和输入通道以及与腔室连通的输出通道。 补偿器设置在腔室中。 在主体和补偿器之间形成有与输入通道和输出通道连通的补偿通道。 加压流体从输入通道流经通过补偿通道的输出通道,并且输出通道中的加压流体流到第一间隙,以保持第一和第二结构之间的相对运动的稳定性和刚性。 还公开了一种使用静压轴承的静压轴承组件。

    Solid capacitor and manufacturing method thereof
    3.
    发明授权
    Solid capacitor and manufacturing method thereof 有权
    固体电容器及其制造方法

    公开(公告)号:US08518127B2

    公开(公告)日:2013-08-27

    申请号:US13176736

    申请日:2011-07-05

    IPC分类号: H01G9/00

    摘要: A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.

    摘要翻译: 固体电容器的制造方法包括以下步骤。 第一步是在绝缘基板上形成多个分离的粘合剂层。 下一步是将阀 - 金属丝布置在粘合剂层上。 下一步是在粘合剂层和阀金属线上形成导电层。 下一步是在阀 - 金属线和导电层的暴露表面上形成电介质结构。 下一步是形成疏水层和导电单元。 下一步是将形成的结构作为单独的电容器分离。 下一步是包装形成的结构和形成连接到形成的结构的端子。

    Conductive structure having an embedded electrode, and solid capacitor having an embedded electrode and method of making the same
    4.
    发明授权
    Conductive structure having an embedded electrode, and solid capacitor having an embedded electrode and method of making the same 有权
    具有嵌入电极的导电结构和具有嵌入电极的固体电容器及其制造方法

    公开(公告)号:US08422200B2

    公开(公告)日:2013-04-16

    申请号:US13115964

    申请日:2011-05-25

    IPC分类号: H01G9/00

    摘要: A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.

    摘要翻译: 具有嵌入电极的固体电容器包括基板单元,第一导电单元,第二导电单元,第一绝缘单元,第三导电单元,第二绝缘单元和端电极单元。 基板单元包括基板主体和嵌入基板主体中的导电体。 基板主体具有侧向开口和多个顶部开口,并且导电体具有从侧向开口暴露的横向导电区域和分别从顶部开口露出的多个顶部导电区域。 第一导电单元包括分别覆盖顶部导电区域的多个第一导电层。 第二导电单元包括覆盖第一导电层的第二导电层。 第二导电层的孔隙率大于每个第一导电层的孔隙率。