摘要:
An active/self-sensing compensating hydrostatic bearing is disposed between first and second structures to allow relative movement between the first and second structures. The hydrostatic bearing includes a body and a compensator. The body, fixed to the first structure and separated from the second structure by a first gap, has a chamber and an input passage and an output passage both communicating with the chamber. The compensator is disposed in the chamber. A compensating passage, communicating with the input passage and the output passage, is formed between the body and the compensator. A pressurized fluid flows from the input passage to the output passage through the compensating passage, and the pressurized fluid in the output passage flows to the first gap to maintain the stability and the rigidity for the relative movement between the first and second structures. A hydrostatic bearing module using the hydrostatic bearing is also disclosed.
摘要:
An active/self-sensing compensating hydrostatic bearing is disposed between first and second structures to allow relative movement between the first and second structures. The hydrostatic bearing includes a body and a compensator. The body, fixed to the first structure and separated from the second structure by a first gap, has a chamber and an input passage and an output passage both communicating with the chamber. The compensator is disposed in the chamber. A compensating passage, communicating with the input passage and the output passage, is formed between the body and the compensator. A pressurized fluid flows from the input passage to the output passage through the compensating passage, and the pressurized fluid in the output passage flows to the first gap to maintain the stability and the rigidity for the relative movement between the first and second structures. A hydrostatic bearing module using the hydrostatic bearing is also disclosed.
摘要:
A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.
摘要:
A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.