公开(公告)号：US07959327B2

公开(公告)日：2011-06-14

申请号：US12422300

申请日：2009-04-13

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Chi-Yuan Lai

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Chi-Yuan Lai

IPC分类号： F21V29/00

CPC分类号： F21V29/70 ,  F21V29/004 ,  F21V29/51 ,  F21V29/75 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.

摘要翻译： LED灯包括灯壳体，由金属制成的散热器并安装在灯壳的底侧，多个LED模块和蒸汽室，其底表面连接到散热器的顶表面， 具有其上附接有LED模块的顶表面，工作液体被密封在蒸气室中。 蒸气室在其中限定了一个密封室，工作液体是相变液体，并被密封在密封室中。 多个肋布置在蒸气室中，用于加强蒸气室的完整性，并且肋将密封室分成多个连通空间。

公开(公告)号：US08388195B2

公开(公告)日：2013-03-05

申请号：US12824208

申请日：2010-06-27

申请人： Cheng-Tien Lai ,  Chi-Yuan Lai ,  Zhi-Yong Zhou

发明人： Cheng-Tien Lai ,  Chi-Yuan Lai ,  Zhi-Yong Zhou

IPC分类号： B60Q1/06 ,  B60Q1/26 ,  F21V29/00

CPC分类号： F21V29/83 ,  F21V29/507 ,  F21V29/745 ,  F21V29/80 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K2201/09063 ,  H05K2201/10106

摘要： An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.

摘要翻译： 示例性照明装置包括外壳，容纳在外壳中的半导体光源以及与外壳接合并覆盖半导体光源的外壳。 由半导体光源产生的光可以穿过信封突出并且离开照明装置。 半导体光源包括彼此独立的多个光源模块。 在每个光源模块中限定多个空气通道，用于穿过其中的空气将半导体光源产生的热量散发到环境空气中。

公开(公告)号：US08196645B2

公开(公告)日：2012-06-12

申请号：US11964919

申请日：2007-12-27

申请人： Chi-Yuan Lai ,  Zhi-Yong Zhou ,  Cheng-Tien Lai

发明人： Chi-Yuan Lai ,  Zhi-Yong Zhou ,  Cheng-Tien Lai

IPC分类号： F28D15/02 ,  F28F7/00 ,  H05K7/20

CPC分类号： F28F1/126 ,  F28D15/0233 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.

摘要翻译： 用于冷却电子部件的散热适配器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管 下板。 下板包括接触热管的面板，从面板向上延伸并与热管分离的两个侧壁，以及两个从两个侧壁相反延伸并焊接在上板上的凸缘。 热管是S形并列并且从头到尾直接接触。

公开(公告)号：US07746642B2

公开(公告)日：2010-06-29

申请号：US12202393

申请日：2008-09-01

申请人： Chi-Yuan Lai ,  Zhi-Yong Zhou ,  Cheng-Tien Lai

发明人： Chi-Yuan Lai ,  Zhi-Yong Zhou ,  Cheng-Tien Lai

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  F28F3/02 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.

摘要翻译： 用于冷却电子部件的散热器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管 下板 下板形成从其向下突出的突起。 突起的底面被研磨成平坦和平滑的，由此底部表面可以紧密接触电子部件。 一种用于制造散热器的方法，包括：铣削从下板向下冲压的突起的底面，由此底表面可以平坦和平滑，足以与电子元件紧密接触，并且将上板依次焊接在 下板和分别在下板和上板上的多个翅片。

公开(公告)号：US07694721B2

公开(公告)日：2010-04-13

申请号：US11309612

申请日：2006-08-31

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).

摘要翻译： 微型液体冷却装置包括壳体（10），其具有附接在发热电子部件上的基部（16），用于吸收由电子部件产生的热量。 壳体包括安装在基座上的外壁（12）和安装在外壁上的顶盖（15）。 收容空间由外壳封闭。 吸热构件（40）安装在基座上并被容纳在容纳空间中以与壳体内的液体进行热交换。 叶轮（21）可旋转地安装在容纳空间中并且在吸热构件上方。 当叶轮旋转时，驱动液体经由液体入口（122）流入液体冷却装置，然后流过吸热构件，并最终经由液体出口（124）从液体冷却装置流出。

公开(公告)号：US07584781B2

公开(公告)日：2009-09-08

申请号：US11309491

申请日：2006-08-11

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou

IPC分类号： F28F7/00 ,  F28F3/12 ,  H05K7/20

CPC分类号： F28F3/086 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling device includes a base, a housing and a heat exchanger. The base and the housing enclose a chamber which receives the heat exchanger therein. Inlet and outlet for liquid are provided at the housing. The heat exchanger includes stacked flakes. Each flake includes parallel and alternately arranged first and second strips each having a void defined therein. The flakes are stacked in a manner such that each first strip overlays and abuts against a corresponding second strip of an adjacent flake and that the void in each first strip and the void in the corresponding second strip of the adjacent flake are in fluid communication with each other to thereby form a channel between the inlet and the outlet.

摘要翻译： 液体冷却装置包括基座，壳体和热交换器。 基座和壳体包围容纳热交换器的腔室。 在壳体处设有用于液体的入口和出口。 热交换器包括堆积的薄片。 每个薄片包括平行且交替布置的第一和第二条带，每个带有限定在其中的空隙。 薄片以这样的方式堆叠，使得每个第一条覆盖并邻接相邻片状物的对应的第二条带，并且每个第一条带中的空隙和相邻片状物的相应第二条带中的空隙与每个 从而在入口和出口之间形成通道。

公开(公告)号：US07447029B2

公开(公告)日：2008-11-04

申请号：US11308231

申请日：2006-03-14

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vapor chamber includes a base (100) for contacting a heat-generating component (500), a cover (200), a first porous capillary sheet (300) located in the base and a second porous capillary sheet (400) located in the cover and facing the first porous capillary sheet. The base comprises a block (130) extending from the base to thermally connect with the cover. The cover is mounted on the base and forms a hermetically sealed container together with the base. The first and second porous capillary sheets together form an enclosure and are contained in the container, and the block extends through the first and second porous capillary sheets and engage therewith.

摘要翻译： 蒸气室包括用于接触发热部件（500），盖（200），位于基座中的第一多孔毛细管板（300）和位于所述第二多孔毛细管板（400）中的基座（100） 覆盖并面向第一多孔毛细管片。 基座包括从基座延伸以与盖子热连接的块体（130）。 盖子安装在基座上，与基座一起形成一个密封的容器。 第一和第二多孔毛细管片一起形成外壳并容纳在容器中，并且块延伸穿过第一和第二多孔毛细管片并与其接合。

公开(公告)号：US20080053641A1

公开(公告)日：2008-03-06

申请号：US11309612

申请日：2006-08-31

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： B29C47/88 ,  F24H3/02

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).

摘要翻译： 微型液体冷却装置包括壳体（10），其具有附接在发热电子部件上的基部（16），用于吸收由电子部件产生的热量。 壳体包括安装在基座上的外壁（12）和安装在外壁上的顶盖（15）。 收容空间由外壳封闭。 吸热构件（40）安装在基座上并被容纳在容纳空间中以与壳体内的液体进行热交换。 叶轮（21）可旋转地安装在容纳空间中并且在吸热构件上方。 当叶轮旋转时，驱动液体经由液体入口（122）流入液体冷却装置，然后流过吸热构件，并最终经由液体出口（124）从液体冷却装置流出。

公开(公告)号：US07301774B2

公开(公告)日：2007-11-27

申请号：US11210130

申请日：2005-08-23

申请人： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Shao-Long Zhai ,  Zhi-Yong Zhou

发明人： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Shao-Long Zhai ,  Zhi-Yong Zhou

IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.

摘要翻译： 用于将散热器固定到发热部件的锁定装置包括锁定板，多个锁定脚，每个锁定脚可枢转地附接到锁定板，以及多个锁定构件，其连接到锁定脚。 多个锁定脚中的相邻的两个能够从锁定脚彼此分开的第一位置朝向彼此旋转，锁定构件将第一安装位置限定到锁定脚堆叠的第二位置 以及限定第二安装位置的锁定构件。

公开(公告)号：US20070165380A1

公开(公告)日：2007-07-19

申请号：US11306896

申请日：2006-01-16

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly (1) includes a printed circuit board (30) having an electronic heat-generating component (40) thereon, a heat sink (20) and a clip (10) for securing the heat sink onto the heat-generating component mounted on the printed circuit board. The heat sink includes a base (22) and a plurality of fins (24) arranged on the base. A recess (28) is defined extending across the fins. The clip includes a retaining portion (12) resting against a face of the printed circuit board opposite the heat sink and an elastic pressing portion (16) spaced from the retaining portion. The pressing portion is received in the recess of the heat sink and resiliently presses the base of the heat sink toward the heat-generating component, whereby the clip clamps the heat sink and the printed circuit board therebetween.

摘要翻译： 存储模块组件（1）包括其上具有电子发热部件（40）的印刷电路板（30），散热器（20）和夹子（10），用于将散热器固定到发热部件 安装在印刷电路板上。 散热器包括基座（22）和布置在基座上的多个翅片（24）。 限定延伸穿过翅片的凹部（28）。 夹子包括一个保持部分（12），该保持部分靠在与散热器相对的印刷电路板的表面上，以及与保持部分间隔的弹性按压部分（16）。 按压部分被容纳在散热器的凹部中，并将散热片的基座弹性地压向发热部件，由此夹子将散热片和印刷电路板夹在其间。