摘要:
The present invention provides a method and apparatus for a memory build-in self-diagnosis and repair with syndrome identification. It uses a fail-pattern identification and a syndrome-format structure to identify faulty rows, faulty columns and single faulty word in the memory during the testing process, then exports the syndrome information. Based on the syndrome information, a redundancy analysis algorithm is applied to allocate the spare memory elements repairing the faulty memory cells. It has a sequencer with enhanced fault syndrome identification, a build-in redundancy-analysis circuit with improved redundancy utilization, and an address reconfigurable circuit with reduced timing penalty during normal access. The invention reduces the occupation time and the required capture memory space in the automatic test equipment. It also increases the repair rate and reduces the required area overhead.
摘要:
The present invention provides a method and apparatus for a memory build-in self-diagnosis and repair with syndrome identification. It uses a fail-pattern identification and a syndrome-format structure to identify faulty rows, faulty columns and single faulty word in the memory during the testing process, then exports the syndrome information. Based on the syndrome information, a redundancy analysis algorithm is applied to allocate the spare memory elements repairing the faulty memory cells. It has a sequencer with enhanced fault syndrome identification, a build-in redundancy-analysis circuit with improved redundancy utilization, and an address reconfigurable circuit with reduced timing penalty during normal access. The invention reduces the occupation time and the required capture memory space in the automatic test equipment. It also increases the repair rate and reduces the required area overhead.
摘要:
Disclosed is a build-in self-diagnosis and repair method and apparatus in a memory with syndrome identification. It applies a fail-pattern identification and a syndrome-format structure to identify at least one type of faulty syndrome in the memory during a memory testing, then generates and exports fault syndrome information associated with the corresponding faulty syndrome. According to the fault syndrome information, the method applies a redundancy analysis algorithm, allocates spare memory elements and repairs the faulty cells in the memory. The syndrome-format structure respectively applies single-faulty-word-syndrome format, faulty-row-segment-syndrome format, and faulty-column-segment-syndrome format for different faulty syndromes, such as faulty row segments and single faulty words, faulty column segments and single faulty words, all of single faulty words, faulty row segments and faulty column segments, and so on.
摘要:
Disclosed is a build-in self-diagnosis and repair method and apparatus in a memory with syndrome identification. It applies a fail-pattern identification and a syndrome-format structure to identify at least one type of faulty syndrome in the memory during a memory testing, then generates and exports fault syndrome information associated with the corresponding faulty syndrome. According to the fault syndrome information, the method applies a redundancy analysis algorithm, allocates spare memory elements and repairs the faulty cells in the memory. The syndrome-format structure respectively applies single-faulty-word-syndrome format, faulty-row-segment-syndrome format, and faulty-column-segment-syndrome format for different faulty syndromes, such as faulty row segments and single faulty words, faulty column segments and single faulty words, all of single faulty words, faulty row segments and faulty column segments, and so on.
摘要:
A built-in memory current test circuit to test a memory on a chip is disclosed, comprising a built-in self-test circuit and a dynamic current generation module. The built-in self-test circuit is disposed on the chip to receive and process a test signal and generate a control signal to control operation of the memory and a current control code. The dynamic current generation module, also disposed on the chip, produces a test current into the memory based on the current control code. The current switch time is reduced in the built-in memory current test circuit, and an integrated test combining functional and stress tests can thus be performed.
摘要:
A built-in memory current test circuit to test a memory on a chip is disclosed, comprising a built-in self-test circuit and a dynamic current generation module. The built-in self-test circuit is disposed on the chip to receive and process a test signal and generate a control signal to control operation of the memory and a current control code. The dynamic current generation module, also disposed on the chip, produces a test current into the memory based on the current control code. The current switch time is reduced in the built-in memory current test circuit, and an integrated test combining functional and stress tests can thus be performed.
摘要:
A semiconductor memory employs the redundancy memory technique and the error correction code technique and method of correcting errors. The method of correcting errors reads data bits and a checking bit from a predetermined unit of a first memory array such as a main memory array, and the data bits are checked based on the checking bit to determine if there is any error. If there is an error in the data bits, the checking bit is used to correct the error and the data bits together with the checking bit are written back to the predetermined unit. If there is still error in the data bits after the read-check-write process is repeated a predetermined number of times, the predetermined unit is marked as a faulty unit and the data bits together with the checking bit are written to a second memory array such as a redundancy memory array.
摘要:
A fiber loop formed by bending of a connection section between the first fiber and the second fiber includes a coupling region and an upper taper region as well as a down taper region arranged symmetrically on two sides of the coupling region. Then the fiber optic splitter with the fiber loop is assembled with a splitting ratio modulation mechanism. Thus the manufacturing of the fiber optic power splitter with variable splitting ratio is simplified and this favors production and applications of the device. Moreover, the splitting and modulation quality of the splitter are stable and are controlled precisely. Thus the economic benefits of the device in manufacturing, operation quality and product competitiveness are all improved.
摘要:
The present invention discloses a probing system for integrated circuit devices, which transmits testing data between an automatic test equipment (ATE) and an integrated circuit device. The ATE includes a first transceiving module, and the integrated circuit device includes a core circuit, a built-in self-test (BIST) circuit electrically connected to the core circuit, a controller configured to control the operation of the BIST circuit, and a second transceiving module configured to exchange testing data with the first transceiving module. Preferably, the integrated circuit device further includes a clock generator and a power regulator electrically connected to the second transceiving module, wherein the ATE transmits a radio frequency signal via the first transceiving module, and the second transceiving module receives the radio frequency signal to drive the power regulator to generate power for the integrated circuit device to initiate the BIST circuit.
摘要:
In a method of testing a multi-port memory in accordance with a test pattern, test clock signals having the same test clock frequency but with different delay periods introduced therein are generated for controlling memory access through the different access ports of the memory. Consecutive memory operations of a test element of the test pattern are then conducted in a folded sequence upon a memory cell through the different access ports in accordance with the test clock signals such that the memory operations are completed within the same test clock cycle of the test element.