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公开(公告)号：US20190035813A1
公开(公告)日：2019-01-31
申请号：US16002317
申请日：2018-06-07
发明人： Shihua HUANG , Zhiyong YANG , Chao FU , Wei HE , Jing WANG , Dexiong SONG , Liwei HUANG , Wei LI , Chao MA , Chaofan LI , Fei CHEN
IPC分类号： H01L27/12 , H01L27/32 , G09G3/3291 , G09G3/3258 , H01L51/52
摘要： A display substrate, including: a display region and two non-display regions provided at two opposite sides of the display region, respectively; proximal end wiring and distal end wiring which are provided in the two non-display regions, respectively, wherein the proximal end wiring is wiring proximal to a driving chip to be employed to provide a driving voltage to the display substrate, and the distal end wiring is wiring distal to the driving chip; pixels provided within the display region; and data lines provided within the display region, wherein each data line is connected to the proximal and distal end wirings, respectively. Each of the pixels is provided with a power introduction structure, the power introduction structures of the pixels are connected to each other to form a mesh structure, and the mesh structure is connected to the proximal and distal end wiring, respectively, to form an electrically-conductive path.
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公开(公告)号：US20220157892A1
公开(公告)日：2022-05-19
申请号：US17348882
申请日：2021-06-16
发明人： Jibum YANG , Myoungsoo LEE , Euiku LEE , Meishan XU , Chao KONG , Na LI , Haijun QIU , Fei CHEN
摘要： A display panel and a fabricating method thereof, and a displaying device. The display panel includes: a driving backplane, a light-emitting-device layer provided on the driving backplane, and a packaging layer, a color-film layer and a light absorbing layer provided on one side of the light-emitting-device layer that is further away from the driving backplane; wherein the light absorbing layer is configured for absorbing light rays of a specific wavelength in external-environment light and in light rays emitted by the light-emitting-device layer; and the specific wavelength includes at least one of a wavelength between a red-light wave band and a green-light wave band, a wavelength between a green-light wave band and a blue-light wave band, a wavelength shorter than a blue-light wave band and a wavelength longer than a red-light wave band.
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公开(公告)号：US20200266214A1
公开(公告)日：2020-08-20
申请号：US16349367
申请日：2018-09-14
发明人： Dexiong SONG , Zhiyong YANG , Liwei HUANG , Shihua HUANG , Xue JIANG , Shibing YUAN , Fei CHEN , Wei LI , Chao FU , Na ZHANG , Yu DU , Xuemei DENG
IPC分类号： H01L27/12
摘要： The present disclosure provides a display panel, a method for manufacturing the same, and a display device. The insulation layer is provided above the first conductive electrodes in the bonding area of the display panel, the insulation layer covers the first conductive electrodes, and the insulation layer is capable of being pierced by ACF particles. When the display panel is bound to an FPC by an ACF, second conductive electrodes on the FPC can be electrically coupled to the first conductive electrodes on the display panel through the ACF particles, thereby achieving the bonding connection between the display panel and the FPC, even if a conductive foreign object falls into the area where the first conductive electrodes are located, short circuit cannot be caused, thereby improving the product yield.
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公开(公告)号：US20240284748A1
公开(公告)日：2024-08-22
申请号：US18569266
申请日：2021-06-18
发明人： Cheng ZENG , Jaeho LEE , Zhen SUN , Lulin MA , Fei CHEN
IPC分类号： H10K59/38 , H10K59/122 , H10K59/80
CPC分类号： H10K59/38 , H10K59/122 , H10K59/873 , H10K59/877 , H10K59/879 , H10K59/8792
摘要： The present disclosure provides a display panel, a display apparatus and a method for manufacturing a display panel. The display panel includes: a base substrate; light-emitting elements located on a side of the base substrate; a color conversion film layer located on a side, away from the base substrate, of the light-emitting elements and including a plurality of color conversion patterns in one-to-one correspondence with the light-emitting elements, each color conversion pattern includes a matrix and color conversion particles distributed in the matrix, and the color conversion particles convert light emitted by the light-emitting elements; and a first film layer located between the light-emitting elements and the color conversion film layer and adjacent to the color conversion film layer, a refractive index n1 of the first film layer and a refractive index n2 of the matrix satisfying: n2/n1>0.82.
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公开(公告)号：US20200064686A1
公开(公告)日：2020-02-27
申请号：US16401445
申请日：2019-05-02
发明人： Li JIANG , Tongmin LIU , Heng ZHANG , Jun XU , Fei CHEN , Aoxiang LI
IPC分类号： G02F1/1335
摘要： A display panel, a driving method thereof and a display device. The display panel includes a plurality of pixel units, the plurality of pixel units includes a first pixel unit, the first pixel unit includes a first sub-pixel, the first sub-pixel includes an infrared luminescent material on a display side, and the infrared luminescent material is capable of emitting infrared light under an irradiation of light emitted by the first sub-pixel.
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6.发明申请公开(公告)号：US20170194389A1
公开(公告)日：2017-07-06
申请号：US15320703
申请日：2016-03-25
发明人： Kun GUO , Yanqing WANG , Bo ZHANG , Fei CHEN , Jianbin FENG , Fan YANG
CPC分类号： H01L27/3213 , H01L27/3218 , H01L51/0011 , H01L51/5012 , H01L51/56
摘要： Embodiments of the present disclosure disclose a pixel structure, a mask plate, an organic electroluminescent display panel and a display device. The pixel structure comprises: a plurality of pixel units arranged in array, each pixel unit comprising four sub-pixels arranged diagonally and having the same shape and size; wherein colors of the four sub-pixels in each pixel unit are different from each other; colors of two adjacent sub-pixels in any two adjacent pixel units are same. The above pixel structure provided by embodiments of the present disclosure may enable the color of any sub-pixel in a pixel unit to be same as the colors of three sub-pixels that are located in other three pixel units adjacent to this pixel unit respectively and are symmetric with this sub-pixel relative to a same point.
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公开(公告)号：US20170047538A1
公开(公告)日：2017-02-16
申请号：US14913090
申请日：2015-07-16
发明人： Zhiliang JIANG , Minghua XUAN , Fengli JI , Bo ZHANG , Fei CHEN , Renrong GAI
CPC分类号： H01L51/52 , H01L23/562 , H01L51/5246 , H01L51/56 , H01L2251/105
摘要： The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.
摘要翻译： 本发明提供了一种电子设备的封装方法，其包括形成封装基板的步骤，形成封装基板的步骤包括：在基底基板上形成限定图案，所述限定图案包括用于限定位置的位置的凹槽 玻璃料 在凹槽中提供胶体玻璃料; 预先烧结胶体玻璃料以获得预先固化的玻璃料; 抛光定义图案的上表面和预先固化的玻璃料; 并去除定义图案，并完全固化预先固化的玻璃料，从而在基底基材上形成固体玻璃料。 本发明还提供一种包装系统。 通过使用本发明提供的包装方法，可以实现更好的包装效果。
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公开(公告)号：US20170194224A1
公开(公告)日：2017-07-06
申请号：US15321172
申请日：2016-02-01
发明人： Fan YANG , Kun GUO , Yuqing YANG , Qi LIU , Bo ZHANG , Fei CHEN , Tianyi CHENG , Zihua LI , Yan WU , Jin YANG , Liman PENG , Chao KONG
IPC分类号： H01L23/08 , H01L23/24 , H01L23/13 , H01L23/053 , H01L23/15
CPC分类号： H01L23/08 , G02F1/133351 , G02F1/1339 , G02F1/13452 , H01L23/053 , H01L23/13 , H01L23/15 , H01L23/24 , H01L51/525
摘要： A display panel and a method for forming the same are disclosed. The display panel includes a first substrate and a second substrate arranged opposite to each other. An integrated circuit (IC) is arranged at a non-display region of the first substrate, and at least one supporting component is arranged beyond a portion of the non-display region where the IC is arranged. A thickness of the at least one supporting component is larger than a thickness of the IC.
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