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公开(公告)号：US11723180B2
公开(公告)日：2023-08-08
申请号：US17467751
申请日：2021-09-07
发明人： Fei Li , Zhihui Yan , Tianliang Liu , Yifei Wang , Hao Huang , Xu Lu
IPC分类号： H05K7/20
CPC分类号： H05K7/20963
摘要： Disclosed are a display module and a method for manufacturing the same, and a display device. The display module includes: a display panel, a heat dissipation layer, a heat conduction assembly, and a driving chip, wherein the display panel includes a first part and a second part opposite to each other, and a bending part connecting the first part and the second part; the heat dissipation layer is disposed on a side, proximal to the second part, of the first part; the heat conduction assembly is disposed between the heat dissipation layer and the second part; an area of an orthographic projection of the heat conduction assembly on the first part is smaller than an area of an orthographic projection of the heat dissipation layer on the first part; and the driving chip is disposed on a side, distal from the heat conduction assembly, of the second part distal.
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公开(公告)号：US12075682B2
公开(公告)日：2024-08-27
申请号：US17639177
申请日：2021-02-02
发明人： Hao Huang , Fei Li , Yaqian Zhang , Xinpeng Wang , Xiaolong Zhu , Hengzhen Liang , Huan Meng
CPC分类号： H10K59/60 , H10K50/841 , H10K50/87 , H10K59/12
摘要： A display device includes first and second camera regions, a function integrating region, and an ambient light sensing region. A display panel has a first through hole in the first camera region, a second through hole in the second camera region, and a non-display region between the through holes. A cover panel is provided on the display side of the display panel. A grid glue has an orthographic projection of the first openings of the two camera regions and has an area greater than an orthographic projection of the through holes. A rigid heat dissipating layer has a second opening in all the four adjacent regions, and an orthographic projection of the second openings has an area greater than the orthographic projection of the first openings, and a photosensitive module defines an orthographic projection with an area greater than the orthographic projections of the first openings and the second openings.
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公开(公告)号：US12035556B2
公开(公告)日：2024-07-09
申请号：US17260007
申请日：2020-03-20
发明人： Xinpeng Wang , Xiaolong Zhu , Hengzhen Liang , Fan Li , Wenxiao Niu , Hao Huang
CPC分类号： H10K50/841 , H10K59/40 , H10K71/00 , H10K71/80 , H10K77/111 , H10K59/1201 , H10K2102/311
摘要： There is provided a display device including a cover plate and a display panel; the cover plate includes a middle plane part, a first edge curved surface part, a second edge covered surface part and a corner curved surface part; the display panel includes a middle part, an edge part and a corner part; the middle part is arranged corresponding to the middle plane part; the edge part includes a first edge part and a second edge part; the first edge part and the first edge curved surface part are arranged correspondingly, and the second edge part and the second edge curved surface part are arranged correspondingly; the corner part and the corner curved surface part are correspondingly arranged; the middle part is in a display area; at least a portion of the edge part and the corner part adjacent to the middle part is in the display area.
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公开(公告)号：US20230320044A1
公开(公告)日：2023-10-05
申请号：US18332128
申请日：2023-06-09
发明人： Fei Li , Zhihui Yan , Tianliang Liu , Yifei Wang , Hao Huang , Xu Lu
IPC分类号： H05K7/20
CPC分类号： H05K7/20963
摘要： Disclosed are a display module and a method for manufacturing the same, and a display device. The display module includes: a display panel, a heat dissipation layer, a heat conduction assembly, and a driving chip, wherein the display panel includes a first part and a second part opposite to each other, and a bending part connecting the first part and the second part; the heat dissipation layer is disposed on a side, proximal to the second part, of the first part; the heat conduction assembly is disposed between the heat dissipation layer and the second part; an area of an orthographic projection of the heat conduction assembly on the first part is smaller than an area of an orthographic projection of the heat dissipation layer on the first part; and the driving chip is disposed on a side, distal from the heat conduction assembly, of the second part distal.
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公开(公告)号：US20220078949A1
公开(公告)日：2022-03-10
申请号：US17467751
申请日：2021-09-07
发明人： Fei Li , Zhihui Yan , Tianliang Liu , Yifei Wang , Hao Huang , Xu Lu
IPC分类号： H05K7/20
摘要： Disclosed are a display module and a method for manufacturing the same, and a display device. The display module includes: a display panel, a heat dissipation layer, a heat conduction assembly, and a driving chip, wherein the display panel includes a first part and a second part opposite to each other, and a bending part connecting the first part and the second part; the heat dissipation layer is disposed on a side, proximal to the second part, of the first part; the heat conduction assembly is disposed between the heat dissipation layer and the second part; an area of an orthographic projection of the heat conduction assembly on the first part is smaller than an area of an orthographic projection of the heat dissipation layer on the first part; and the driving chip is disposed on a side, distal from the heat conduction assembly, of the second part distal.
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