公开(公告)号：US08013748B2

公开(公告)日：2011-09-06

申请号：US12327218

申请日：2008-12-03

Applicant: Chi-Fen Chen ,  Jen Jui Cheng

Inventor： Chi-Fen Chen ,  Jen Jui Cheng

IPC: G08B17/00 ,  G06F19/00 ,  G01N21/00

CPC classification number: H01L21/67248

Abstract: A method for monitoring the temperature and slope of a wafer is presented, and the steps of the method comprises: (a) providing a cooling machine, a monitoring system, a sensing module, and a wafer; (b) cooling the wafer by the cooling machine; (c) sensing all regions of the wafer by the sensing module, and detecting the temperature and slope of the wafer relative to the cooling machine; (d) if the wafer's temperature is higher than a set temperature, the monitoring system outputs a first alarm signal, if the wafer's slope is greater than a set slope, the monitoring system outputs a second alarm signal.

Abstract translation: 提出了一种用于监测晶片的温度和斜率的方法，该方法的步骤包括：（a）提供冷却机，监测系统，感测模块和晶片; （b）通过冷却机冷却晶片; （c）通过感测模块感测晶片的所有区域，以及检测晶片相对于冷却机的温度和斜率; （d）如果晶片的温度高于设定温度，则监视系统输出第一报警信号，如果晶片的斜率大于设定的斜率，则监视系统输出第二报警信号。