Abstract:
A method for monitoring the temperature and slope of a wafer is presented, and the steps of the method comprises: (a) providing a cooling machine, a monitoring system, a sensing module, and a wafer; (b) cooling the wafer by the cooling machine; (c) sensing all regions of the wafer by the sensing module, and detecting the temperature and slope of the wafer relative to the cooling machine; (d) if the wafer's temperature is higher than a set temperature, the monitoring system outputs a first alarm signal, if the wafer's slope is greater than a set slope, the monitoring system outputs a second alarm signal.
Abstract:
A mini clean room for preventing wafer pollution includes a robot arm, a clean room body slidably disposed on the robot arm and at least one lock unit which is rotatably connected with the clean room body. During operation, the robot arm extends out of the clean room body to carry a wafer waiting to be processed, and then moves back into the clean room body which can provide an isolated and protected space for the wafer to avoid that the wafer is polluted. The present invention also discloses a method of using a mini clean room for preventing wafer pollution.