公开(公告)号：US06521997B1

公开(公告)日：2003-02-18

申请号：US10039268

申请日：2002-01-02

申请人： Chien-Ping Huang ,  Wei-Chen Tseng ,  Yu-Ting Lai

发明人： Chien-Ping Huang ,  Wei-Chen Tseng ,  Yu-Ting Lai

IPC分类号： H01L2348

CPC分类号： H01L23/3121 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/19041 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： A chip carrier for accommodating a passive component is proposed, allowing at least a chip to be electrically connected to the chip carrier. At least a pair of spaced-apart solder pads are formed on the chip carrier in no interference with the electrical connection between the chip and the chip carrier. A passive component is bonded at its two ends onto the solder pads by solder paste that electrically connects the passive component to the chip carrier. A recessed portion formed between the pair of the solder pads, is associated with a bottom surface of the passive component to form a passage, allowing a resin material for encapsulating the passive component or the chip to pass through and fill the passage, whereby the filled passage can prevent bridging of the solder paste and short circuit of the passive component from occurrence, thereby making yield of fabricated products desirably improved.

摘要翻译： 提出了用于容纳无源部件的芯片载体，至少使芯片电连接到芯片载体。 至少一对间隔开的焊盘形成在芯片载体上，不会干扰芯片和芯片载体之间的电连接。 无源元件的两端通过将无源部件与芯片载体电连接的焊膏焊接到焊盘上。 形成在所述一对焊盘之间的凹部与被动部件的底面相关联，以形成通道，允许用于封装被动部件或芯片的树脂材料通过并填充通道，由此填充 通过可以防止焊膏的桥接和被动部件的短路不发生，从而使制造产品的产量理想地提高。

公开(公告)号：US06271581B1

公开(公告)日：2001-08-07

申请号：US09490724

申请日：2000-01-25

申请人： Chien-Ping Huang ,  Wei-Chen Tseng

发明人： Chien-Ping Huang ,  Wei-Chen Tseng

IPC分类号： H01L23495

摘要： A semiconductor package structure having universal lead frame and heat sink comprises a chip, a lead frame, a heat sink, a bonding wire, and a molding compound. The leads of the lead frame approaches toward the center portion of the lead frame in order to adapt to various sizes of the chip. The heat sink is mounted on and connected to the leads of the lead frame, and the periphery of the heat sink overlaps the front end of the leads wherein the dimension of the heat sink is not smaller than the size of the chip. The chip is disposed on the heat sink that is also functioned as die pad. The chip is electrically connected to the leads by a bonding wire that is designed to be the shortest. An “electrically insulative, and thermally conductive layer” is employed for bonding the heat sink to the lead frame. A molding compound is employed to encapsulate the chip, a portion or the whole piece of the heat sink, the leads of the lead frame, and the bonding wires that arc electrically connected between the chip and the leads.

公开(公告)号：US20100180713A1

公开(公告)日：2010-07-22

申请号：US12320150

申请日：2009-01-21

申请人： Wei-Chen Tseng

发明人： Wei-Chen Tseng

IPC分类号： B62K21/16

CPC分类号： B62K21/16 ,  B62K19/32

摘要： An expanding and retracting structure for a control shaft of a bicycle mounted on a cylinder member includes a positioning member, and an engaging member, the positioning member and the engaging member being disposed on a top end of the cylinder member, the engaging member being a locking loop to be quickly retracted or expanded its inner diameter and to move the positioning member, in the cylinder member being fixed a bolt element; a screw screwed in the bolt element and having a tab mounted on a top portion thereof; a shaft member pivotally connecting with the screw, and the screw and the shaft member being insert into the cylinder member, the shaft member including a positioning slot to insert the positioning member, at a predetermined position of the shaft member being connected a connecting tube.

摘要翻译： 一种安装在气缸构件上的自行车的控制轴的伸缩结构包括定位构件和接合构件，定位构件和接合构件设置在气缸构件的顶端上，接合构件为 锁紧环可快速缩回或扩大其内径并移动定位构件，在气缸构件中固定螺栓元件; 拧在螺栓元件中并具有安装在其顶部上的突片的螺钉; 轴构件与螺杆枢转地连接，并且螺杆和轴构件插入到气缸构件中，该轴构件包括定位槽以将定位构件插入到轴构件的预定位置处，连接有连接管。