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公开(公告)号:US07594810B2
公开(公告)日:2009-09-29
申请号:US11260427
申请日:2005-10-28
申请人: Chih-Ching Tzeng , Den-Lian Lin , Shiaw-Huei Chen , Ming-Song Yang , Jyh-Ming Yan , Yuh-Jenq Yu
发明人: Chih-Ching Tzeng , Den-Lian Lin , Shiaw-Huei Chen , Ming-Song Yang , Jyh-Ming Yan , Yuh-Jenq Yu
摘要: The present invention provides a reactor utilizing high-voltage discharge for processing exhausted hydrogen gas emitted during membrane plating, etching, or washing of semiconductors, where higher than 95% of destruction and removal efficiency (DRE) of hydrogen gas is obtained.
摘要翻译: 本发明提供了一种利用高压放电来处理半导体膜电镀,蚀刻或清洗过程中排放的氢气的反应器,其中获得高于氢气的破坏和去除效率(DRE)的95%。
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公开(公告)号:US20070111147A1
公开(公告)日:2007-05-17
申请号:US11260427
申请日:2005-10-28
申请人: Chih-Ching Tzeng , Den-Lian Lin , Shiaw-Huei Chen , Ming-Song Yang , Jyh-Ming Yan , Yuh-Jeng Yu
发明人: Chih-Ching Tzeng , Den-Lian Lin , Shiaw-Huei Chen , Ming-Song Yang , Jyh-Ming Yan , Yuh-Jeng Yu
IPC分类号: F01N3/00
摘要: The present invention provides a reactor utilizing high-voltage discharge for processing exhausted hydrogen gas emitted during membrane plating, etching, or washing of semiconductors, where higher than 95% of destruction and removal efficiency (DRE) of hydrogen gas is obtained.
摘要翻译: 本发明提供了一种利用高压放电来处理半导体膜电镀,蚀刻或清洗过程中排放的氢气的反应器,其中获得高于氢气的破坏和去除效率(DRE)的95%。
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