公开(公告)号：US20070125570A1

公开(公告)日：2007-06-07

申请号：US11564944

申请日：2006-11-30

Applicant: Chin Wei HO

Inventor： Chin Wei HO

IPC: H05K1/03 ,  H05K1/16

CPC classification number: H05K3/403 ,  H05K1/115 ,  H05K3/043 ,  H05K3/42 ,  H05K2201/09645

Abstract: A via structure of a printed circuit board includes an insulation layer having a first surface and a second surface, a through-hole and a plurality of internal conducting coatings. The through-hole is throughout the first surface and the second surface of the insulation layer and the internal conductive coatings connected to a wall of the through-hole are mutually electrically insulated so that different signals can be transmitted between both sides of the substrate through a single via.

Abstract translation: 印刷电路板的通孔结构包括具有第一表面和第二表面的绝缘层，通孔和多个内部导电涂层。 通孔遍及整个绝缘层的第一表面和第二表面，连接到通孔的壁的内部导电涂层相互电绝缘，使得不同的信号可以通过一个 单通道。