公开(公告)号：US07109740B2

公开(公告)日：2006-09-19

申请号：US11167147

申请日：2005-06-28

申请人： Chin-Chen Chuan ,  Chiu-Cheng Lin ,  Cheng Chieh Lee ,  Kuei Lin Huang ,  Yong Liang Chen ,  Jui Liang Wang ,  Pao Ta Chien ,  Hsiang-Han Kung ,  Chao Hsiung Hwu

发明人： Chin-Chen Chuan ,  Chiu-Cheng Lin ,  Cheng Chieh Lee ,  Kuei Lin Huang ,  Yong Liang Chen ,  Jui Liang Wang ,  Pao Ta Chien ,  Hsiang-Han Kung ,  Chao Hsiung Hwu

IPC分类号： G01R31/26

CPC分类号： G01R31/2893

摘要： A method for re-testing semiconductor device includes following processes: (1) providing a first carrier for accommodating semiconductor devices which have been tested; (2) taking the semiconductor devices out from the first carrier and placing them according to the information of a fist map by a pick-and-place machine, wherein the information of the first map has the coordinates of the positions of the film frame where the semiconductor is to be placed; (3) placing the film frame with the semiconductor devices placed thereon to a testing machine, and re-testing the semiconductor devices according to the information of the first map by the tester; (4) placing the film frame with the semiconductor devices attached thereon to a pick-and-place machine, and taking the semiconductor devices out according to the result of the retesting from the film frame, and placing the semiconductor devices on at least one carriers.

摘要翻译： 一种重新测试半导体器件的方法包括以下过程：（1）提供用于容纳已被测试的半导体器件的第一载体; （2）将半导体器件从第一载体上取出，并通过拾取放置机器根据拳头映射的信息进行放置，其中第一映射的信息具有胶片帧位置的坐标， 要放置半导体; （3）将其上放置有半导体器件的胶卷框架放置在测试机上，并由测试者根据第一张图的信息重新测试半导体装置; （4）将其上安装有半导体器件的胶卷框架放置在拾放机上，并根据从胶片框架重新测试的结果取出半导体装置，并将半导体装置放置在至少一个载体 。