公开(公告)号：US20060022697A1

公开(公告)日：2006-02-02

申请号：US11167147

申请日：2005-06-28

申请人： Chin-Chen Chuan ,  Chiu-Cheng Lin ,  Cheng Lee ,  Kuei Huang ,  Yong Chen ,  Jui Wang ,  Pao Chien ,  Hsiang-Han Kung ,  Chao Hwu

发明人： Chin-Chen Chuan ,  Chiu-Cheng Lin ,  Cheng Lee ,  Kuei Huang ,  Yong Chen ,  Jui Wang ,  Pao Chien ,  Hsiang-Han Kung ,  Chao Hwu

IPC分类号： G01R31/26

CPC分类号： G01R31/2893

摘要： A method for re-testing semiconductor device includes following processes: (1) providing a first carrier for accommodating semiconductor devices which have been tested; (2) taking the semiconductor devices out from the first carrier and placing them according to the information of a fist map by a pick-and-place machine, wherein the information of the first map has the coordinates of the positions of the film frame where the semiconductor is to be placed; (3) placing the film frame with the semiconductor devices placed thereon to a testing machine, and re-testing the semiconductor devices according to the information of the first map by the tester; (4) placing the film frame with the semiconductor devices attached thereon to a pick-and-place machine, and taking the semiconductor devices out according to the result of the retesting from the film frame, and placing the semiconductor devices on at least one carriers.