公开(公告)号：US06680531B2

公开(公告)日：2004-01-20

申请号：US10007406

申请日：2001-12-03

申请人： Chin-Teng Hsu ,  Fu-Di Tung ,  Chen-Shih Yu ,  Jui-Hsiang Hung ,  Chin-Yuan Hung

发明人： Chin-Teng Hsu ,  Fu-Di Tung ,  Chen-Shih Yu ,  Jui-Hsiang Hung ,  Chin-Yuan Hung

IPC分类号： H01L2334

CPC分类号： H01L21/565 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A multi-chip semiconductor package is proposed, in which a lead frame is formed with a chip carrier that consists of at least one supporting frame and a plurality of downwardly extending portions integrally formed with the supporting frame. As the chip carrier occupies small space, this does not impede flowing of a molding compound used for forming an encapsulant. The adjacent extending portions are provided with sufficient space therebetween for allowing the molding compound to flow through the space, so that problems of incomplete filling with the molding compound and the formation of voids can be eliminated. Moreover, the downwardly extending portions can function as a pre-stressed structure so as to closely abut a bottom of a mold cavity after mold engagement, thereby making the chip carrier well assured in position without being dislocated.

摘要翻译： 提出了一种多芯片半导体封装，其中引线框架形成有由至少一个支撑框架和与支撑框架一体形成的多个向下延伸部分组成的芯片载体。 由于芯片载体占用较小的空间，这并不妨碍用于形成密封剂的模塑料的流动。 相邻的延伸部分之间设置有足够的空间以允许模塑料流过该空间，从而可以消除模塑料填充不完全和形成空隙的问题。 此外，向下延伸的部分可以用作预应力结构，以便在模具接合之后紧密地邻接模腔的底部，从而使芯片载体良好地保持就位，而不会脱位。