公开(公告)号：US20060197392A1

公开(公告)日：2006-09-07

申请号：US11069519

申请日：2005-03-02

Applicant: Ching Yang ,  Chin Chen

Inventor： Ching Yang ,  Chin Chen

IPC: H02K7/00 ,  H02K5/16 ,  H02K11/00 ,  H02K1/22

CPC classification number: H02K21/125 ,  F04D25/0613 ,  H02K5/1735 ,  H02K21/24 ,  H02K2201/12

Abstract: A motor structure comprises a rotor having a driving portion and a magnetic element; the magnetic element being assembled to a lower end of the driving portion; and a stator including an electrode sheet, a coil, and a seat; the coil winding around a stator flame assembling the seat; a magnetic induction portion being protruded from the electrode sheet; and the electrode sheet being installed to the seat. The rotor is pivotally installed to the stator and the magnetic induction portion of the electrode sheet is arranged corresponding to the magnetic element so that after conduction, the coil is interacted with the magnetic element by using phase differences therebetween.

Abstract translation: 电机结构包括具有驱动部分和磁性元件的转子; 所述磁性元件被组装到所述驱动部分的下端; 以及包括电极片，线圈和座的定子; 线圈缠绕在定子火焰上组装座椅; 磁感应部分从电极片突出; 电极片安装在座椅上。 转子枢转地安装到定子上，电极片的磁感应部分对应于磁性元件设置，使得在导电之后，线圈通过使用它们之间的相位差与磁性元件相互作用。

公开(公告)号：US20060043553A1

公开(公告)日：2006-03-02

申请号：US11217612

申请日：2005-09-02

Applicant: Ching Yang ,  Chun Huang

Inventor： Ching Yang ,  Chun Huang

IPC: H01L23/02

CPC classification number: H01L23/4093 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A chip package mainly includes a substrate, a stiffener, a chip, a thermal interface material (TIM) and a heat spreader. The stiffener is disposed on the substrate and has a receiving portion. The chip is disposed on the substrate. The thermal interface material (TIM) is formed on a surface of the chip. The heat spreader has a resilient-buckling portion, which is snapped into the receiving portion of the stiffener, whereby the heat spreader can contact the thermal interface material (TIM), the bond line thickness of the thermal interface material between the chip and the heat spreader can be controlled, and the heat spreader is prevented from sliding during a packaging process.

Abstract translation: 芯片封装主要包括基板，加强件，芯片，热界面材料（TIM）和散热器。 加强件设置在基板上并具有接收部分。 芯片设置在基板上。 热界面材料（TIM）形成在芯片的表面上。 散热器具有弹性弯曲部分，其被卡扣到加强件的接收部分中，由此散热器可以接触热界面材料（TIM），芯片和热量之间的热界面材料的粘结线厚度 可以控制撒布机，并且在包装过程中防止散热器滑动。