公开(公告)号：US09073750B2

公开(公告)日：2015-07-07

申请号：US14459646

申请日：2014-08-14

Applicant: Chiung-Cheng Lo ,  Kuan-Lin Chen

Inventor： Chiung-Cheng Lo ,  Kuan-Lin Chen

IPC: H01L21/00 ,  B81C1/00

CPC classification number: B81C1/0069 ,  B81C1/00238 ,  B81C1/00269 ,  B81C1/00444 ,  B81C2203/0109 ,  B81C2203/0792

Abstract: The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.

Abstract translation: 本发明提供一种MEMS器件的制造方法，其包括：在衬底上提供包括衬底和电结构的集成电路器件，电结构包括至少一个感测区域和至少一个第一连接部分; 提供结构层，并在所述结构层上形成至少一个第二连接部分; 键合所述至少一个第一连接部分和所述至少一个第二连接部分; 蚀刻所述结构层以形成至少一个可移动结构，所述可移动结构位于对应于所述感测区域的位置的位置，并且所述可移动结构经由所述至少一个第二连接件连接到所述至少一个第一连接部分 部分; 之后，设置盖以覆盖可移动结构和感测区域，其中可移动结构不直接连接到盖。

公开(公告)号：US20150056733A1

公开(公告)日：2015-02-26

申请号：US14459646

申请日：2014-08-14

Applicant: Chiung-Cheng Lo ,  Kuan-Lin Chen

Inventor： Chiung-Cheng Lo ,  Kuan-Lin Chen

IPC: B81C1/00

CPC classification number: B81C1/0069 ,  B81C1/00238 ,  B81C1/00269 ,  B81C1/00444 ,  B81C2203/0109 ,  B81C2203/0792

Abstract: The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.

Abstract translation: 本发明提供一种MEMS器件的制造方法，其包括：在衬底上提供包括衬底和电结构的集成电路器件，电结构包括至少一个感测区域和至少一个第一连接部分; 提供结构层，并在所述结构层上形成至少一个第二连接部分; 键合所述至少一个第一连接部分和所述至少一个第二连接部分; 蚀刻所述结构层以形成至少一个可移动结构，所述可移动结构位于对应于所述感测区域的位置的位置，并且所述可移动结构经由所述至少一个第二连接件连接到所述至少一个第一连接部分 部分; 之后，设置盖以覆盖可移动结构和感测区域，其中可移动结构不直接连接到盖。

公开(公告)号：US20060038790A1

公开(公告)日：2006-02-23

申请号：US10919329

申请日：2004-08-17

Applicant: Chien-Chung Chen ,  Kuan-Lin Chen ,  Chin-Pei Hwang

Inventor： Chien-Chung Chen ,  Kuan-Lin Chen ,  Chin-Pei Hwang

IPC: G09G5/00

CPC classification number: G06F3/041 ,  G06F3/044

Abstract: A touch panel has a substrate, a non-oxide adhesive layer and an indium tin oxide (ITO) film. The non-oxide adhesive layer is attached on the substrate and the ITO film is attached on the non-oxide adhesive layer. The non-oxide adhesive layer will not diffuse oxygen in the high temperature environment to affect the indium tin oxide film, so that the panel keeps in a thermal stable condition.

Abstract translation: 触摸面板具有基板，非氧化物粘合层和氧化铟锡（ITO）膜。 将非氧化物粘合剂层附着在基板上，将ITO膜附着在非氧化物粘合剂层上。 非氧化物粘合剂层不会在高温环境中扩散氧气以影响氧化铟锡膜，使得面板保持热稳定状态。