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公开(公告)号：US11953392B1
公开(公告)日：2024-04-09
申请号：US18370897
申请日：2023-09-21
发明人： Tongqing Liu
CPC分类号： G01L19/0618 , B81B7/0032 , B81C1/00261 , B81C1/0069 , G01L19/04
摘要： The present application discloses a packaging structure and method of an MEMS pressure sensor. The packaging structure of the MEMS pressure sensor includes: a film, forming a sealing chamber with a base, during manufacturing the sealing chamber is internally equipped with a sensing medium and a pressure sensor chip, when the external pressure increases, the film bends towards an inner side of the sealing chamber to cause the sealing chamber to contract and transmit pressure to the pressure sensor chip through the sensing medium. The packaging structure of the present application can avoid the sensing chip from being damaged by excessive contraction of the sealing chamber due to pressure overload, and thus achieves overload protection.
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公开(公告)号：US20240056054A1
公开(公告)日：2024-02-15
申请号：US18449102
申请日：2023-08-14
申请人： SiTime Corporation
发明人： Charles I. Grosjean , Ginel C. Hill , Paul M. Hagelin , Renata Melamud Berger , Aaron Patridge , Markus Lutz
CPC分类号： H03H9/2457 , H03H3/0072 , H03H3/0076 , H03H9/1057 , B81C1/0069
摘要： A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.
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3.发明公开公开(公告)号：US20240043263A1
公开(公告)日：2024-02-08
申请号：US18244479
申请日：2023-09-11
CPC分类号： B81B3/0021 , B81C1/0069 , B81C2201/013 , B81C2201/0156
摘要： A method for manufacturing an optical microelectromechanical device, includes forming, in a first wafer of semiconductor material having a first surface and a second surface, a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements extending between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. The method continues with forming, in a second wafer, a chamber delimited by a bottom wall having a through opening, and bonding the second wafer to the first surface of the first wafer and bonding a third wafer to the second surface of the first wafer so that the chamber overlies the actuation structure, and the through opening is aligned to the suspended mirror structure, thus forming a device composite wafer. The device composite wafer is diced to form an optical microelectromechanical device.
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公开(公告)号：US11851321B2
公开(公告)日：2023-12-26
申请号：US17188933
申请日：2021-03-01
发明人： Ting-Li Yang , Kai-Di Wu , Ming-Da Cheng , Wen-Hsiung Lu , Cheng Jen Lin , Chin Wei Kang
CPC分类号： B81B3/0081 , B81C1/0069 , B81B2203/019 , B81B2203/0127 , B81B2203/0353 , B81B2207/015 , B81C2201/013 , B81C2201/0181 , B81C2203/032 , B81C2203/0735
摘要： A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.
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公开(公告)号：US11708263B2
公开(公告)日：2023-07-25
申请号：US17313565
申请日：2021-05-06
发明人： Faez Ba-Tis , Ahmed Galaom , Ridha Ben-Mrad
CPC分类号： B81B3/0081 , B81C1/0069 , G02B5/208 , G02B7/02 , H02N1/006 , H04N23/52 , H04N23/54 , B81B2201/03 , B81B2203/0163 , B81B2207/07
摘要： A camera system incorporating a MEMS actuator to achieve focus adjustments to compensate for the thermal expansion of the lens assembly is disclosed. The camera comprises a lens barrel, lens holder, infra-red (IR) filter, board circuit, MEMS actuator, housing package for the actuator, and an image sensor. The image sensor is directly wire bonded to pads on the circuit board such that these pads are movable at the image sensor end and fixed at the circuit board end. When the camera is exposed to temperature variations, the MEMS actuator moves the sensor along the optical axis to maintain the image in focus.
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6.发明授权公开(公告)号：US08733170B2
公开(公告)日：2014-05-27
申请号：US12683888
申请日：2010-01-07
CPC分类号： B81C1/0069 , B81B3/0081 , B81B2201/025 , B81C1/00158 , B81C1/00666 , G01C19/56 , G01C19/5755 , G01P1/006 , G01P15/125 , G01P15/18 , G01P2015/0814 , H03H9/02448 , H03H2009/02496 , Y10T29/43
摘要： A micro-electromechanical device includes a semiconductor substrate, in which a first microstructure and a second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the substrate so as to undergo equal strains as a result of thermal expansions of the substrate. Furthermore, the first microstructure is provided with movable parts and fixed parts with respect to the substrate, while the second microstructure has a shape that is substantially symmetrical to the first microstructure but is fixed with respect to the substrate. By subtracting the changes in electrical characteristics of the second microstructure from those of the first, variations in electrical characteristics of the first microstructure caused by changes in thermal expansion or contraction can be compensated for.
摘要翻译： 微机电装置包括半导体衬底，其中第一微结构和第二参考微结构被集成。 第一微结构和第二微结构被布置在基板中，以便由于基板的热膨胀而产生相等的应变。 此外，第一微结构相对于基板设置有可移动部件和固定部件，而第二微结构具有与第一微结构基本对称的形状，但是相对于基板固定。 通过从第一微结构的电特性减去第一微结构的电特性的变化，可以补偿由热膨胀或收缩的变化引起的第一微结构的电特性的变化。
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7.发明申请Method for producing a component, in particular a micromechanical and/or microfluidic and/or microelectronic component, and component 失效用于制造组分，特别是微机械和/或微流体和/或微电子组件以及组件的方法公开(公告)号：US20100294710A1
公开(公告)日：2010-11-25
申请号：US12308522
申请日：2007-05-04
申请人： Tino Fuchs , Christina Leinenbach
发明人： Tino Fuchs , Christina Leinenbach
CPC分类号： B81C1/0069 , B01D61/243 , B01D67/003 , B01D67/0058 , B01D71/02 , B01D2323/35 , B01D2325/028 , B01D2325/08 , B01D2325/26 , B81B2201/10 , B81C2201/0115 , Y10T428/24893
摘要： A method for producing a component, and a component, in particular a micromechanical and/or microfluidic and/or microelectronic component, is provided, the component including at least one patterned material region, and in a first step the patterned material region is produced in that microparticles of a first material are embedded in a matrix of a second material, and in a second step the patterned material region is rendered porous by etching using a dry etching method or a gas-phase etching method.
摘要翻译： 提供了一种用于制造组件和组件，特别是微机械和/或微流体和/或微电子部件的方法，所述部件包括至少一个图案化材料区域，并且在第一步骤中，图案化材料区域 将第一材料的微粒嵌入第二材料的基体中，在第二步骤中，通过使用干蚀刻法或气相蚀刻法蚀刻图案化材料区域而使多孔化。
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8.发明授权Method for producing a component having a semiconductor substrate and component 有权用于制造具有半导体衬底和部件的部件的方法公开(公告)号：US07803646B2
公开(公告)日：2010-09-28
申请号：US10544821
申请日：2003-11-06
申请人： Frank Fischer , Thorsten Pannek , Lars Metzger
发明人： Frank Fischer , Thorsten Pannek , Lars Metzger
IPC分类号： H01L21/00
CPC分类号： B81C1/0069 , B81C2201/0115
摘要： A method for producing a component having a semiconductor substrate, in which porous semiconductor material is generated for the purpose of developing at least one thermally decoupled pattern. In the material that has been rendered porous, a recess or a plurality of recesses is/are etched to produce at least one region that is defined by the one recess or the plurality of recesses and is thermally decoupled. On the at least one region, the pattern to be thermally decoupled is then formed.
摘要翻译： 一种用于制造具有半导体衬底的部件的方法，其中产生多孔半导体材料用于形成至少一个热解耦图形。 在已经被多孔化的材料中，凹陷或多个凹陷被蚀刻以产生由一个凹部或多个凹部限定并且被热解耦的至少一个区域。 在至少一个区域上，形成待热解耦的图案。
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公开(公告)号：US20070054433A1
公开(公告)日：2007-03-08
申请号：US11222721
申请日：2005-09-08
申请人： Jeffrey DeNatale , Robert Borwick , Philip Stupar
发明人： Jeffrey DeNatale , Robert Borwick , Philip Stupar
IPC分类号： H01L21/00
CPC分类号： B81C1/0069 , B81C2203/032
摘要： A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer—typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments.
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10.发明申请公开(公告)号：US20060226114A1
公开(公告)日：2006-10-12
申请号：US10543357
申请日：2003-09-25
申请人： Frank Fischer , Lars Metzger
发明人： Frank Fischer , Lars Metzger
IPC分类号： C23F1/00
CPC分类号： B81C1/00047 , B81B2203/0127 , B81C1/0069 , B81C2201/0109
摘要： A method for manufacturing a micromechanical device and a resulting micromechanical device are provided, the device having a substrate material, a membrane, and a cavity situated between the substrate and the membrane in a membrane cavity area. In this method, holes are first produced through the membrane in a first etching step, and the cavity is subsequently produced using a second etching step.
摘要翻译： 提供了一种用于制造微机械装置和所得微机械装置的方法，该装置具有在膜腔区域中位于基板和膜之间的基板材料，膜和空腔。 在该方法中，首先在第一蚀刻步骤中通过膜产生孔，然后使用第二蚀刻步骤制造空腔。
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