公开(公告)号：US09073750B2

公开(公告)日：2015-07-07

申请号：US14459646

申请日：2014-08-14

Applicant: Chiung-Cheng Lo ,  Kuan-Lin Chen

Inventor： Chiung-Cheng Lo ,  Kuan-Lin Chen

IPC: H01L21/00 ,  B81C1/00

CPC classification number: B81C1/0069 ,  B81C1/00238 ,  B81C1/00269 ,  B81C1/00444 ,  B81C2203/0109 ,  B81C2203/0792

Abstract: The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.

Abstract translation: 本发明提供一种MEMS器件的制造方法，其包括：在衬底上提供包括衬底和电结构的集成电路器件，电结构包括至少一个感测区域和至少一个第一连接部分; 提供结构层，并在所述结构层上形成至少一个第二连接部分; 键合所述至少一个第一连接部分和所述至少一个第二连接部分; 蚀刻所述结构层以形成至少一个可移动结构，所述可移动结构位于对应于所述感测区域的位置的位置，并且所述可移动结构经由所述至少一个第二连接件连接到所述至少一个第一连接部分 部分; 之后，设置盖以覆盖可移动结构和感测区域，其中可移动结构不直接连接到盖。

公开(公告)号：US20150056733A1

公开(公告)日：2015-02-26

申请号：US14459646

申请日：2014-08-14

Applicant: Chiung-Cheng Lo ,  Kuan-Lin Chen

Inventor： Chiung-Cheng Lo ,  Kuan-Lin Chen

IPC: B81C1/00

CPC classification number: B81C1/0069 ,  B81C1/00238 ,  B81C1/00269 ,  B81C1/00444 ,  B81C2203/0109 ,  B81C2203/0792

Abstract: The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.

Abstract translation: 本发明提供一种MEMS器件的制造方法，其包括：在衬底上提供包括衬底和电结构的集成电路器件，电结构包括至少一个感测区域和至少一个第一连接部分; 提供结构层，并在所述结构层上形成至少一个第二连接部分; 键合所述至少一个第一连接部分和所述至少一个第二连接部分; 蚀刻所述结构层以形成至少一个可移动结构，所述可移动结构位于对应于所述感测区域的位置的位置，并且所述可移动结构经由所述至少一个第二连接件连接到所述至少一个第一连接部分 部分; 之后，设置盖以覆盖可移动结构和感测区域，其中可移动结构不直接连接到盖。

公开(公告)号：US20160096728A1

公开(公告)日：2016-04-07

申请号：US14966562

申请日：2015-12-11

Applicant: Yu-Fu Kang ,  Chiung-Cheng Lo

Inventor： Yu-Fu Kang ,  Chiung-Cheng Lo

IPC: B81C1/00

CPC classification number: B81C1/00285 ,  B81B7/0038 ,  B81B7/02 ,  B81B2207/015 ,  B81C2201/013 ,  B81C2201/019 ,  B81C2203/0792

Abstract: A MEMS chip includes a cap layer and a composite device layer. The cap layer includes a substrate. The substrate has a first region and a second region, wherein the first region includes plural first trenches and the second region has plural second trenches. The first region has a first etch pattern density and the second region has a second etch pattern density, wherein the first etch pattern density is higher than the second etch pattern density to form chambers of different pressures.

公开(公告)号：US09362257B2

公开(公告)日：2016-06-07

申请号：US14643531

申请日：2015-03-10

Applicant: Chiung-Cheng Lo ,  Yu-Fu Kang ,  Ning-Yuan Wang ,  Chiung-Wen Lin

Inventor： Chiung-Cheng Lo ,  Yu-Fu Kang ,  Ning-Yuan Wang ,  Chiung-Wen Lin

IPC: B81B7/00 ,  B81B7/02 ,  B81C1/00 ,  B81C3/00 ,  H01L25/00

CPC classification number: H01L25/00 ,  B81C1/00238 ,  B81C2203/0792 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.

Abstract translation: 本发明提供了一种微电子机械系统（MEMS）模块，其包括堆叠在电子电路管芯上的MEMS管芯。 所述电子电路管芯包括衬底，所述衬底包括贯穿所述衬底的至少一个穿硅通孔（TSV）; 和至少一个电子电路。 电子电路包括电路区域和直接连接TSV的信号传输层。 至少一根导线连接在MEMS管芯的中间部分和TSV之间。 在MEMS管芯堆叠在其上并与电子电路管芯接合的接口位置处没有信号通信。

公开(公告)号：US20150210541A1

公开(公告)日：2015-07-30

申请号：US14504953

申请日：2014-10-02

Applicant: Yu-Fu Kang ,  Chiung-Cheng Lo

Inventor： Yu-Fu Kang ,  Chiung-Cheng Lo

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00285 ,  B81B7/0038 ,  B81B7/02 ,  B81B2207/015 ,  B81C2201/013 ,  B81C2201/019 ,  B81C2203/0792

Abstract: A MEMS chip includes a cap layer and a composite device layer. The cap layer includes a substrate. The substrate has a first region and a second region, wherein the first region includes plural first trenches and the second region has plural second trenches. The first region has a first etch pattern density and the second region has a second etch pattern density, wherein the first etch pattern density is higher than the second etch pattern density to form chambers of different pressures.

Abstract translation: MEMS芯片包括盖层和复合器件层。 盖层包括基底。 衬底具有第一区域和第二区域，其中第一区域包括多个第一沟槽，而第二区域具有多个第二沟槽。 第一区域具有第一蚀刻图案密度，第二区域具有第二蚀刻图案密度，其中第一蚀刻图案密度高于第二蚀刻图案密度以形成不同压力的室。

公开(公告)号：US09624090B2

公开(公告)日：2017-04-18

申请号：US14728153

申请日：2015-06-02

Applicant: Chia-Yu Wu ,  Chiung-Cheng Lo

Inventor： Chia-Yu Wu ,  Chiung-Cheng Lo

IPC: B81B3/00

CPC classification number: B81B3/0051 ,  B81B3/0027 ,  B81B3/0072 ,  B81B2201/0235 ,  B81B2203/04 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814

Abstract: The invention provides a micro-electro-mechanical system device including: a substrate; a proof mass, including an outer frame which inwardly defines an internal space, and at least one inner extension portion which is directly connected to the outer frame and inwardly extends from the outer frame; at least one compliant structure, located in the internal space, and directly connected to the corresponding inner extension portion; an anchor, located in the internal space and directly connected to the at least one compliant structure, the anchor being connected to the substrate; movable electrodes, located in the internal space and connected to the proof mass; and fixed electrodes, respectively located in correspondence to the movable electrodes, and being connected to the substrate through fixing portions.

公开(公告)号：US09562926B2

公开(公告)日：2017-02-07

申请号：US14708140

申请日：2015-05-08

Applicant: Chiung-Wen Lin ,  Chiung-Cheng Lo ,  Yu-Fu Kang

Inventor： Chiung-Wen Lin ,  Chiung-Cheng Lo ,  Yu-Fu Kang

IPC: G01P15/00 ,  G01P15/18 ,  G01P15/125 ,  G01P15/08

CPC classification number: G01P15/18 ,  G01P15/125 ,  G01P2015/082

Abstract: The invention provides an MEMS device. The MEMS device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode. The proof mass is connected to the substrate through the spring and the spring anchor. The proof mass includes a hollow structure inside, and the spring anchor, the first electrode anchor, and the second electrode anchor are located in the hollow structure. The proof mass and the first fixed electrode form a first capacitor, and the proof mass and the second fixed electrode form a second capacitor. There is neither any portion of the proof mass nor any portion of any fixing electrode located between the first electrode anchor, second electrode anchor, and the spring anchor.

Abstract translation: 本发明提供一种MEMS装置。 MEMS器件包括：衬底，校准块，弹簧，弹簧锚，第一电极锚和第二电极锚，第一固定电极和第二固定电极。 检测质量通过弹簧和弹簧锚连接到基板。 检测质量体包括内部的中空结构，弹簧锚固件，第一电极锚固件和第二电极锚固件位于中空结构中。 检测质量和第一固定电极形成第一电容器，并且检测质量块和第二固定电极形成第二电容器。 在第一电极锚固件，第二电极锚固件和弹簧锚固件之间，没有任何部分的证明质量和任何固定电极的任何部分。

公开(公告)号：US20160370397A1

公开(公告)日：2016-12-22

申请号：US14742393

申请日：2015-06-17

Applicant: Shih-Chieh Lin ,  Chiung-Cheng Lo

Inventor： Shih-Chieh Lin ,  Chiung-Cheng Lo

IPC: G01P1/00 ,  G01P15/125

CPC classification number: G01P1/003 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0822 ,  G01P2015/0871

Abstract: The present invention discloses a MEMS device. The MEMS device includes a substrate, a proof mass, a frame spring and an anchor. The proof mass is connected to the substrate through the frame spring and the anchor. The proof mass includes a proof mass body, a proof mass frame surrounding the proof mass body, a linking element connecting the proof mass body to the proof mass frame, and a stopper between the proof mass body and the proof mass frame in a displacement direction to limit the displacement of the proof mass body. The stopper is connected to the proof mass frame as a part of the proof mass and contributes to the mass quantity of the proof mass.

Abstract translation: 本发明公开了一种MEMS装置。 MEMS器件包括衬底，校验块，框架弹簧和锚固件。 检测质量通过框架弹簧和锚固件连接到基板。 检测质量体包括检测质量体，围绕检验质量体的检测质量框架，将检验质量体与检验质量框架连接的连接元件以及位移方向上的检验质量体与检验质量框架之间的塞子 以限制检验质量体的位移。 止动件作为检测质量的一部分连接到检验质量框架，并有助于质量块的质量。

公开(公告)号：US20160257557A1

公开(公告)日：2016-09-08

申请号：US14728153

申请日：2015-06-02

Applicant: Chia-Yu Wu ,  Chiung-Cheng Lo

Inventor： Chia-Yu Wu ,  Chiung-Cheng Lo

IPC: B81B3/00

CPC classification number: B81B3/0051 ,  B81B3/0027 ,  B81B3/0072 ,  B81B2201/0235 ,  B81B2203/04 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814

Abstract: The invention provides a micro-electro-mechanical system device including: a substrate; a proof mass, including an outer frame which inwardly defines an internal space, and at least one inner extension portion which is directly connected to the outer frame and inwardly extends from the outer frame; at least one compliant structure, located in the internal space, and directly connected to the corresponding inner extension portion; an anchor, located in the internal space and directly connected to the at least one compliant structure, the anchor being connected to the substrate; movable electrodes, located in the internal space and connected to the proof mass; and fixed electrodes, respectively located in correspondence to the movable electrodes, and being connected to the substrate through fixing portions.

Abstract translation: 本发明提供了一种微电子机械系统装置，包括：基板; 包括向内限定内部空间的外框架以及直接连接到所述外框架并且从所述外框架向内延伸的至少一个内延伸部分的检验质量块; 至少一个柔性结构，位于所述内部空间中，并且直接连接到相应的内部延伸部分; 锚固件，位于所述内部空间中并且直接连接到所述至少一个柔性结构，所述锚固件连接到所述基板; 可移动电极，位于内部空间并连接到校验块; 以及固定电极，其分别对应于可动电极，并且通过固定部分连接到基板。

公开(公告)号：US20160169927A1

公开(公告)日：2016-06-16

申请号：US14708140

申请日：2015-05-08

Applicant: Chiung-Wen Lin ,  Chiung-Cheng Lo ,  Yu-Fu Kang

Inventor： Chiung-Wen Lin ,  Chiung-Cheng Lo ,  Yu-Fu Kang

IPC: G01P1/00

CPC classification number: G01P15/18 ,  G01P15/125 ,  G01P2015/082

Abstract: The invention provides an MEMS device. The MEMS device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode. The proof mass is connected to the substrate through the spring and the spring anchor. The proof mass includes a hollow structure inside, and the spring anchor, the first electrode anchor, and the second electrode anchor are located in the hollow structure. The proof mass and the first fixed electrode form a first capacitor, and the proof mass and the second fixed electrode form a second capacitor. There is neither any portion of the proof mass nor any portion of any fixing electrode located between the first electrode anchor, second electrode anchor, and the spring anchor.

Abstract translation: 本发明提供一种MEMS装置。 MEMS器件包括：衬底，校准块，弹簧，弹簧锚，第一电极锚和第二电极锚，第一固定电极和第二固定电极。 检测质量通过弹簧和弹簧锚连接到基板。 检测质量体包括内部的中空结构，弹簧锚固件，第一电极锚固件和第二电极锚固件位于中空结构中。 检测质量和第一固定电极形成第一电容器，并且检测质量块和第二固定电极形成第二电容器。 在第一电极锚固件，第二电极锚固件和弹簧锚固件之间，没有任何部分的证明质量和任何固定电极的任何部分。