公开(公告)号：US06285077B1

公开(公告)日：2001-09-04

申请号：US09377887

申请日：1999-08-19

申请人： Chok J. Chia ,  Seng-Sooi Allen Lim ,  Qwai Hoong Low

发明人： Chok J. Chia ,  Seng-Sooi Allen Lim ,  Qwai Hoong Low

IPC分类号： H01L2348

CPC分类号： H01L23/3128 ,  H01L23/49833 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A package for an integrated circuit is disclosed. The package comprises two layers (a top layer and a bottom layer) of flexible tape, each of which has a top surface and a bottom surface, with metal traces on the top surface. A die is mounted on top of the two layers and wire bonds connect bond pads on the die to metal traces on each of the two flexible tapes. The metal traces are routed along the top surfaces of the flexible tapes and are coupled to solder balls through holes in the tapes. These solder balls are mounted along the bottom of the package and serve as the electrical interface to a printed circuit board. Additional holes in the bottom layer tape allow solder balls to extend through the bottom layer tape so that they may be electrically coupled to traces on the top layer tape.

摘要翻译： 公开了一种用于集成电路的封装。 该包装包括柔性带的两层（顶层和底层），每层具有顶表面和底表面，顶表面具有金属迹线。 模具安装在两层的顶部，引线接合将模具上的接合焊盘连接到两个柔性带中的每一个上的金属迹线。 金属迹线沿着柔性带的顶表面布线，并通过带中的孔耦合到焊球。 这些焊球沿着封装的底部安装并用作印刷电路板的电接口。 底层带中的另外的孔允许焊球延伸穿过底层带，使得它们可以电耦合到顶层带上的迹线。